Electronics Forum | Fri Jun 12 14:28:17 EDT 2009 | isd_jwendell
Minimize scavanging by the attached trace and provide more uniform temperatures between all pads.
Electronics Forum | Tue Jun 09 13:16:18 EDT 2009 | jack100
We are looking at feasibility concerns of using a QFN 16 from Motorola. I have a couple of questions regarding their recommended PCB design guidelines. 1) Does anyone know why they would recommend coming out of the pads with a narrow trace (.1mm wid
Electronics Forum | Thu Mar 24 11:04:41 EDT 2011 | smt_guy
Hi, I have a 2.75" x 1" x 0.027"thick CCA with SOIC16W and QFN56 as well as some 0201's, 0402's and QFN16 Components that are to be enclosed via molding process. Is there any Insert Moling, Over Molding Circuit Card Assembly Guidelines out there fr
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