Electronics Forum | Wed Nov 01 08:55:05 EST 2006 | russ
See if the solder is leaving the pad(s) and is wicking up the component. This is long shot but I have seen something similar to this possibly in a wave process. We had a very thin board and a very large QFP on top. During wave operation the solder
Electronics Forum | Mon Jan 26 10:15:51 EST 2009 | john123
Can anyone help me determine the acceptability level for lead deformation (see attachment). The outer two leads on the left side were bent during the pick and place centering operation. I've looked in the IPC-A-610 book and could only find informa
Electronics Forum | Wed Apr 21 03:05:09 EDT 1999 | Raul N.
Thanks for all your inputs.... Raul
Electronics Forum | Sun Nov 25 20:47:44 EST 2001 | Yngwie
knock!!!knock!!!Hellooo!!!!!!!
Electronics Forum | Mon Nov 26 21:03:29 EST 2001 | davef
Hehwoo, bin eatin' turkey up at mums house.
Electronics Forum | Wed Jan 14 10:07:38 EST 2004 | Patrick
More on QFP soldering issue as per Paul f original e-mail. 1. Problems occured on different PCB's, on different lines using different equipment 2. Flux residue is common in the dimple on the solder. 3. The fault occurred using both "Kester 265" & "Al
Electronics Forum | Thu Apr 01 11:27:17 EST 2004 | Jimmy
I have some fine pitch QFP's to rework with our smt rework system (forced air). There are no intitial concerns in removing the component (we havent actually begun the rework process) however, installing a new chip presents a problem. The QFP has
Electronics Forum | Mon Aug 29 12:11:09 EDT 2005 | Kris
what is the plating on the component ? Lead free ?
Electronics Forum | Mon Sep 10 18:04:28 EDT 2007 | slthomas
How are you attaching your thermocouples to measure the temperature of the lead/pad connection?
Electronics Forum | Wed Oct 01 07:54:25 EDT 2008 | davef
You might need to straighten the leads prior to soldering.
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