Electronics Forum | Thu Mar 28 11:06:49 EST 2002 | Tony Fox
Our company carries out this service for major OEM and CEM's Our web site address is http://www.retronix.co.uk Every device after it has been re-tinned gose throught a vision inspection system were it is inspected for coplinarity etc, we also re-ball
Electronics Forum | Thu Dec 12 13:37:33 EST 2002 | gregoryyork
Have you considered the plating of the component could be Pb free as this generally wont be liquidus until 232C typically. seeing more and more of these unmarked components coming through so worth checking latest batch of problems on unmarked QFP's a
Electronics Forum | Tue Mar 19 11:52:25 EST 2002 | davef
We have had Corfin recommended to us, but have never needed to use them. Also consider: * EMPF uses a ROSA process for solder rejuvenation. Check with Cal [at Manncorp, a SMTnet regular] for the scoop [chocolate, vanilla, or ROCKY ROCOCO] on EMPF.
Electronics Forum | Tue Mar 19 14:23:44 EST 2002 | caldon
PETE - Since you are local to ACI/EMPF you can take a run over there and speak with Greg Parks,PhD on ROSA. His phone number is 610-362-1200 x 267 or email gparks@aciusa.org. This method is much better than the "re tinning". They can actually revert
Electronics Forum | Mon Sep 29 11:44:39 EDT 2008 | manishc
We r facing less soder problem with qfp,using 4 mil tencil and lead free paste,tried out different combinations of reflow profile,can anybody suggest?
Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F
Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:
Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert
I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i
Electronics Forum | Tue Jul 02 15:20:16 EDT 2019 | daniel_marquette
Hi, any idea what can cause 5% intermittent right component lead being bent during CTA transfer to the forks? Yet, everything is line up on these 2.5 mm lead span components.
Electronics Forum | Tue Jul 09 06:11:15 EDT 2019 | alpha1
I would check the clearance between the bottom guide and the carrier clip. Usually I set it .004 below the clop then set the head height .004 above the guide. It's a little tighter than UIC specs but it'll prevent the lead better.
Electronics Forum | Mon Jul 22 09:54:57 EDT 2019 | daniel_marquette
Had to adjust more finely the timing on the soft push and the down stroke for insertion. I added flow controls on both input of the respectives cylinders with enough success to start production. This way, the soft push is late enough not to screw the
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