Electronics Forum | Mon Dec 08 18:52:47 EST 2003 | Craig M
Stability of process is what your measuring so lets not assume a stable process(if your process was perfect you would have no defects). With no test a medium complexity board will be around 68.7% (according to Consulogic). I dont have many other sour
Electronics Forum | Wed Apr 14 17:25:01 EDT 1999 | Stephen Oltmann
A company in Santa Clara California specializes in repair of fine pitch using automated inspection and repair equipment. They guarantee their work and include bake and dry pack. Go to http://www.sixsigmaservices.com/services.htm | DOES ANY ONE KNOW
Electronics Forum | Thu Sep 17 10:22:55 EDT 1998 | Frank Johnson
| Does anybody know of a tool to rework bent legs on a QFP package ? Ben, We have a complete line of MilProbes that are used to rework leads of any pitch size. Please take a look at our web site and request a free sample there. We are also a regula
Electronics Forum | Wed Jun 28 21:50:18 EDT 2006 | adihsr
BGA is better- in terms of 1.0 no bent leads or coplanarity problems 2.0 self align on solder pads 3. easy solder printing 4. large pitch ...I think those who goes for QFP have not had a strong SMT experience. Do not be hurt byt this is a basic SMT D
Electronics Forum | Thu Apr 08 09:10:31 EDT 1999 | Frank Johnson
Greg, We at Beau Tech make all size picks and probes for straightening leads and other repair/rework tasks. Sounds like you can use a 10-MilProbe for your job. Please visit the Beau Tech web site at the following address www.beautech.com or call u
Electronics Forum | Wed Apr 07 21:31:25 EDT 1999 | Scott McKee
| DOES ANY ONE KNOW HOW I CAN STRAIGHTEN | BENT PINS ON A FINE PITCH QFP WITH OUT DAMAGING | THE CHIP. AT $300 A CHIP I CAN'T SCRAP THEM. | I use tweezers and picks. I place the component down on it's backside (legs up) and manually tweek them un
Electronics Forum | Thu Jun 16 22:14:51 EDT 2005 | davef
16 thou pitch parts: Use a 5 thou laser cut electropolished stencil with 0.008"x0.045" apertures and type 3 solder paste. Bridges Connecting or Partially Connecting Adjacent Leads or Lands * Excessive solder paste * Excessive component placement pre
Electronics Forum | Wed Jul 12 11:35:07 EDT 2006 | samir
Let's pretend there's no complication with RoHS, backward, foreward compatability - bla, bla, bla Vikings. I would pick the BGA hands-down! 1.) The BGA Ball, the component's lead, IS the solder joint! 2.) No complanarity issues, bent leads, etc
Electronics Forum | Thu Mar 11 12:11:02 EST 2004 | russ
Jon, one other option. Metcal makes tips for the MX stations that are for removing All sorts of Ic components. They are custom sized for each QFP size. If you have the MX stations this is a great way to go. These tips only heat the leads and par
Electronics Forum | Thu Sep 17 09:52:34 EDT 1998 | Ben Wilmot
Does anybody know of a tool to rework bent legs on a QFP package ?
