Electronics Forum: qfp solder non wetting (Page 1 of 33)

BGA non wetting

Electronics Forum | Fri Sep 17 03:03:29 EDT 2010 | grahamcooper22

Hi Gani, looking at the HASL icture and the poor wetting of the solder over the pads I would imagine that the HASL coating is very thin on the pads and in actual fact isn't 'solder' but is tin /copper intemetallic and this has poor solderability. It

Component non wetting

Electronics Forum | Mon Apr 26 17:12:14 EDT 2004 | babe

Take a solder iron with some wire solder and attempt to tin the leads of the component. Look under magnifier or microscope. Did they wet? If not try fluxing them with liquid flux and then soldering again. Did they wet? If they did not then you may wa

Component non wetting

Electronics Forum | Thu Apr 22 04:55:42 EDT 2004 | Richard

Have you tried using Concoat MUST II solderability tester to test on the component terminal are of good solderability. Non-wetting may occur due to oxidation or contamination on component terminal. So for immediate response to you problems is to used

Component non wetting

Electronics Forum | Thu Apr 22 21:34:58 EDT 2004 | adam

Thanks guys. I am from a subcon, we can't change the solder paste supplier and there is only one approved vendor for this component. I think I will try on the component solderability. Regards

BGA non wetting

Electronics Forum | Tue Sep 14 02:46:17 EDT 2010 | grahamcooper22

Hi Gani, Looking at the pictures in the report it looks as if there is a thin coating of solder on the pcb pad....but it looks like the BGA sphere was barely in contact with the pad. This could be caused by insufficient solder paste on this pad...may

BGA non wetting

Electronics Forum | Tue Sep 14 14:22:11 EDT 2010 | grahamcooper22

If the HASL was poor quality and very thin you would find this defect....but you would expect to see it on more pads also. Also, you'd expect to see your solder from your solder paste either dewetted on the pad or reflowed onto the BGA sphere making

BGA non wetting

Electronics Forum | Wed Sep 15 01:16:36 EDT 2010 | dan_ems

Hello, what type of solder paste use, and this component is made for lead process?

BGA non wetting

Electronics Forum | Tue Sep 14 21:03:42 EDT 2010 | genesan

Hi Sir, The diameter of the aperature is 17mil and thickness 6mil and since we are using Solder Paste Inspection i believe that should have a good paste deposit on this pad.Let say if no good paste it will more create insufficient solder which X-RAY

BGA non wetting

Electronics Forum | Mon Sep 13 22:32:41 EDT 2010 | genesan

Hi all good morning and need advice from expertise here. One of my customer complain that they have constantly issues with one of their product and ask us to do cross section.The report show there was “no wetting to the PCB copper pad” and cause the

BGA non wetting

Electronics Forum | Mon Sep 13 22:58:49 EDT 2010 | genesan

Hi all good morning and need advice from expertise here. One of my customer complain that they have constantly issues with one of their product and ask us to do cross section.The report show there was “no wetting to the PCB copper pad” and cause the

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