Electronics Forum | Fri May 12 08:58:04 EDT 2023 | tommy_magyar
This is a defect in all IPC classes. Solder has not wetted to the land where solder is required.
Electronics Forum | Fri Sep 08 08:00:41 EDT 2006 | davef
That's your clue. Your reflow is running ~240*C and your soldering iron is running ~370*C. Dial-up the heat.
Electronics Forum | Thu Sep 07 10:32:12 EDT 2006 | slthomas
Is the solder reflowing on the pad but not wicking up the lead, or does there appear to be insufficient solder to wet both, or is it not reflowing at all, or.....? Have you verified your profile? What is the condition of your paste (expiration date,
Electronics Forum | Thu Sep 07 10:45:46 EDT 2006 | vicknesh28
Yes solder is reflowing on the pad but doesnt wick up the lead. Solder paste is sufficient. It just forms a saddle like appearance beneath the failing lead. The failed lead doesnt get reflowed at all. What puzzles me is how can hundreds of leads wet
Electronics Forum | Mon Aug 27 10:58:44 EDT 2001 | Ryan Jennens
Steve- We had the same trouble with 0805 Panasonic film caps. We had some tombstoning and open solder joints (non-wetting). We found two problems...like you, we changed our pad design to meet their recommendation. Also, they were able to suppl
Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001
I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Mon Nov 10 08:53:23 EST 2014 | jpal
We have the opportunity to buy a new selective solder machine and are used to using a very old Jade machine with a moving tank and wetted nozzle. I have two process concept questions: Which is better- move the board over the nozzle or move the nozz
Electronics Forum | Sat Sep 28 05:30:44 EDT 2002 | ivanchu
Stencil cleaning process is taking by machine every 15 boards. We are using wet, vaccune, Dry, Dry cleaning process. The aperture of the stencil is fullfil the aspect ratio.
Electronics Forum | Mon Sep 23 03:12:01 EDT 2002 | surachai
We encounter this problem also , I know that it 's acceptable per IPC standard but sometime it fail at ICT and FCT , then this problem should be prevent , we found it with QFP 16 mil pitch and the defect looklike negative wetting at the front of lead
