Electronics Forum | Tue Mar 27 06:37:14 EDT 2007 | realchunks
There is no "standard" or "procedure". Your customer is putting a requirement on you because this has probably lead to weak QFP solder joints breaking in the field or non-functioning units due to co-planar QFP legs. I�ve been there done that. Had
Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny
Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif
Electronics Forum | Wed Oct 30 02:37:58 EST 2002 | Dreamsniper
Hi Guys, I have a fine pitch QFP that I suspect of having a solderability (wetability) problem. The heel joint is 50%-75% of the lead thickness so it means that I passed the IPC Class 2 recommended criteria on the Heel. The toe has at least 25%-50% s
Electronics Forum | Mon Mar 16 01:06:25 EST 1998 | Victor Ng
Dear all, Recently I have a problem of non-wetting at our wave soldering process. It appears only on the SMT pads for the chip components (at the solder side) of the HASL PCB. With all the same parameters on the wave soldering machine, i
Electronics Forum | Sat Jun 02 08:47:25 EDT 2007 | mika
I almost forgot; If the pcb have HASL (Non RoHS) surface finish, then big fine pitch QFP:s could be shifted during reflow, beacuse of the un-even pad-surface... We have been trough that scenario also... But step No.1 is to make sure that the componen
Electronics Forum | Thu Aug 25 08:45:16 EDT 2005 | PWH
Agree with Dan - we have had non-plated IC's that are a bit corroded come in and seen similar problems. Could it be that the tinning/plating process missed a corner somehow???
Electronics Forum | Mon Dec 20 16:34:15 EST 2004 | steve
Customer has tried OA and NC alloy solder pads may be nickel Chromium. Non-wetting issue. Scraping pad alloys a bit of adhesion of solder but no intermettalic bond. Any suggestions?
Electronics Forum | Wed Mar 01 03:39:10 EST 2006 | dave
Hi Davef, Basically there is very poor signs of wetting ,the hole fill from the top of the board is non-existant and we are using 63/37 solder bars (wave solder machine).
Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Wed Oct 04 10:18:51 EDT 2006 | greg york
Now seen the Blow Holes and shallow inverted and non wetting problem an aweful lot over here. Over came the Blow Holes and shallow inverted joints by washing the bare PCB with hot Saponifier then rinse and dry = problem dissapears. Think most PCB ven
