Electronics Forum: quad flat no lead (Page 1 of 2)

Changing Ni/Au finish to HASL lead free

Electronics Forum | Tue Dec 21 12:28:27 EST 2010 | wrongway

I know when we used them we had problems when one pad is 7 mils tall nest to a flat pad one lead touches the pad the lead next to it isnt touching anything so then have an open I don't see how anybody dosnt have problems with it that use quad flatpa

Soldering Method for Fine Pitch QFP's

Electronics Forum | Thu Feb 12 17:25:15 EST 1998 | Chuck Griffith

What is the proven industry solder attachment process for installing 240 lead (gull wing) quad flat packages with lead pitch

Re: Soldering Method for Fine Pitch QFP's

Electronics Forum | Fri Feb 27 14:27:54 EST 1998 | David Spilker

| What is the proven industry solder attachment process for installing 240 lead (gull wing) quad flat packages with lead pitch

Re: Soldering Method for Fine Pitch QFP's

Electronics Forum | Fri Feb 13 12:56:23 EST 1998 | Scott Cook

| What is the proven industry solder attachment process for installing 240 lead (gull wing) quad flat packages with lead pitch

QFP Coplanarity & Alloy 42

Electronics Forum | Tue Sep 30 21:00:41 EDT 2003 | davef

We're not clear on what you seek. So, as a starting point for our discussion, we wouldn't get agitated if we saw "routine" coplanarity of 4 thou. For instance: Maximum Lead Coplanarity [Altera] Package||Acronym||Lead material||Finish||Maximum Lead

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef

Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef

Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ

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