Electronics Forum | Fri Mar 25 05:33:18 EDT 2011 | Nigel, RAKON
We have the occasional solder fine but the main issue I have is with small - large balls of solder around an 0402 capacitor. Our LF paste data sheet states a %rH of 25 - 70, I have recorded an average for March of 14.9 - 38.5 %rH. Every other requirm
Electronics Forum | Fri Nov 19 14:40:48 EST 2004 | glaucon
The R.H of 28-30% is too low! (What about ESD issues?). Have them check to see if the printer/print area has a "breeze blowing" accross it, they can disconnect fans inside if needed to limit airflow from drying the paste out.
Electronics Forum | Mon Nov 07 07:43:56 EST 2005 | pjc
No way I've ever heard to remove mositure from solderpaste. What is the R.H. in your factory? Are you in the tropics? Does you printer have an enclosed print area like on an automatic machine, or is it semi-automatic and exposed to the room air?
Electronics Forum | Fri Dec 13 11:00:33 EST 2013 | davef
I'm not aware of a standard for the storage conditions of assemble circuit boards. Here's what I'd do: * Protect them from damage * Store them vertically * Constant Temperature 22°C +/- 3°C * Humidity Control 45% To 65% R.H.
Electronics Forum | Tue Feb 28 22:32:38 EST 2023 | cbeneat
it looks like the table is in contact with the Y1 switch. If you can remove the cover, the motor is the R/H one. Turning the belt will move that side of the table. I'm going with the assumption that an X4 is close to an X5.
Electronics Forum | Mon Nov 24 07:36:15 EST 2008 | davef
No, but we find discussions about relative humidity fairly short sighted, because relative humidity is such an imperfect measure of the amount of moisure in the air. Dew point is much more appealing. R.H. = (amount of moisture)/(maximum amount that
Electronics Forum | Fri Oct 01 10:05:29 EDT 2010 | rrpowers
You don't necessarily have to bake the flex circuits, but you do have to worry about moisture. Polyimide is very hydroscopic, and depending on the flex construction, any moisture in the product can lead to delamination. Adhesive based flex circuits
Electronics Forum | Tue Sep 21 15:31:05 EDT 1999 | Hugh Martin
| | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | Thank you.
Electronics Forum | Mon May 20 10:49:12 EDT 2002 | geoff_goring
Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? In our case we are being told that this process is starting before assembly. Is it fundamentally the same thing. i.e. will the Tin diffuse with th
Electronics Forum | Wed Sep 22 17:21:45 EDT 1999 | Hugh Martin
| | | | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | | |
