Electronics Forum | Tue Dec 28 22:29:14 EST 2004 | davef
Doesn't make sense. Either your: * Oven is not operting properly [attach your profiler thermocouple to the baffle of each zone with a screw to check] ... OR * Conveyor speed is too high ... OR * Profiler is defective
Electronics Forum | Mon Jul 12 05:01:30 EDT 2010 | cobar
Please follow the paste suppliers specs for the paste as an indicator.Most people think that if they follow the paste suppliers recommendations to the T it will be a perfect profile but this is not the case.Play around with preheat settings but follo
Electronics Forum | Tue Jun 24 06:58:53 EDT 2003 | sanjeevc
Hi The temprature for the first zone should be more as the PCB entering the oven from the ambient shop floor temprature needs a higher temp.Next zone could be lower than the first zone.The ramp is a relation of conveyor speed and the temp profile.T
Electronics Forum | Tue Jun 17 07:17:09 EDT 2003 | James
The main problem I am having is getting the Rising slope 1-3 degrees. If I slow the conveyor down then I have too long of a reflow and if I speed it up then my ramp rate is too high. I was not sure if I need my first zones at a low temp or higher t
Electronics Forum | Mon Jun 16 13:57:48 EDT 2003 | James
Could anyone give me a basic profile temperature settings for a conceptronics 7 zone oven and speed? I have the first couple of zones ramped up to get to the soak temperatures. Is this correct or should I start out with low temperatures and graduall
Electronics Forum | Wed Jun 25 12:20:03 EDT 2003 | russ
This may make it easy, Do you really need soak? Or can you just ramp to reflow. Most pastes that I am aware of perform just as well using the linear ramp as opposed to the ramp/soak /spike. Now, out of curiosity how are you attaching the thermocou
Electronics Forum | Wed Jun 25 18:17:48 EDT 2003 | Brian W.
Water soluble pastes generally work best with a ramp-to-spike reflow profile. Check your paste manufacturer's recommended profile. There are many factors that impact your profile; board thickness, component density, buried thermal masses, board si
Electronics Forum | Thu Jun 26 09:50:05 EDT 2003 | James
To Brian W. I think I will use your concept thanks for the help and from all the others that gave me suggestions. I seem to get best results from a Low temp at first with hardly no soak and just a ramp to spike. Thanks again.
Electronics Forum | Mon Nov 16 10:50:50 EST 2009 | ppcbs
I agree customer is being overly stringent, and that their is a possibility that BGA's have voids prior to installation. If you determine that the BGA's do not have voids prior to installation I suggest you slow down your ramp speed to allow the flu
Electronics Forum | Mon Mar 08 15:37:41 EST 2004 | pdeuel
What type of P&P machine? Useing any Placement force? Ramp speed in reflow? PCB thickness properly defined? Tooling supports too high? Any doubble stacking of parts? Occuring with only one part manufacturer? Start with processes where problem is note
