Electronics Forum | Fri Jun 06 06:11:18 EDT 2014 | paulg
I have a large monoblock ceramic filter on a PTFE based pcb material. The filter has a metal casing soldered onto the ceramic filter. I am concerned that if the heating rate is to rapid, then thermal shock / differential expansion could cause the fil
Electronics Forum | Wed Apr 12 20:41:31 EDT 2000 | Dave F
Russ: That�s a pretty stand-up postin� bud. It�s neat that you can root-out that dirt. We couldn�t dig-up that stuff, if they threatened to shoot the dog. You could be correct about using convex for waving. We don�t wave RNET as Philips suggests
Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef
Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co
Electronics Forum | Thu Mar 04 12:34:48 EST 2004 | cyber_wolf
I know that many smaller companies clean their stencils the same way you do. If you get good results cleaning your stencils this way then I would say stick with the alcohol/wipe method. Take your stencil and put it under a microscope.If the aperture
Electronics Forum | Thu Mar 04 18:18:02 EST 2004 | Ken
There is a japanese company that makes a ultrasonic hand-held stencil cleaner. I demo'd it for a day and it was fantastic! It even cleaned epoxy stencils. Can't recall the price...but it should be much much less than the smart sonic and other "mac
Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean
Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de
Electronics Forum | Tue Jul 30 08:38:55 EDT 2002 | dasal
Truthfully, there are pro's and con's for both technologies. (put cost of ownership aside for one moment) Nitrogen won't dry humidified components as rapidly as a desiccant dry box. I'm talking about a self regenerating dry box that uses molecular s
Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny
Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera
Electronics Forum | Sun Sep 02 09:06:42 EDT 2018 | davef
Cold resistance between the tip of the tool and the ground reference, tip current leakage, and tip voltage. per ANSI ESD STM 13.1 J-STD-001 Rev G, Appendix “A” Guidelines for Soldering Tools and Equipment: A-2 BENCHTOP AND HAND SOLDERING SYSTEMS Se
Electronics Forum | Sat Jul 22 13:20:35 EDT 2023 | shrikant_borkar
Dear Abhishek, I too got the opportunity to investigate this defect Lift lead for SOT. Lead lift in IC, and SOT can occur due to various reasons. Here are some possible reasons for lead lift and ways to avoid them: During the assembly process, mecha
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