Electronics Forum | Tue Jul 18 16:40:09 EDT 2006 | dphilbrick
We have a system where when we set up the line to run a job before the first part is placed an auditor verifies we have all the correct parts loaded on the machines in thier correct locations. We then run a first article. The board is inspected to in
Electronics Forum | Tue May 05 11:12:01 EDT 2015 | anirudh_thabjul
Thankyou once again dude. Please Don't mind it. I have one more doubt regarding the Max.Power Rating of SMD Resistor. ---"Is same principle which you told application for Maximum Power rating Of SMD Resistor also"?--- i.e Higher Powerrating is
Electronics Forum | Tue Aug 31 10:52:19 EDT 1999 | Andreas Foehrenbach
I'm in univerity research on SMT assembly systems. Especialy Simulation and Optimisation using OR-Methods. We developed flexible simulation models of various assembly-machines and use them for performance estimation (Components per hour) under differ
Electronics Forum | Tue May 05 09:58:51 EDT 2015 | anirudh_thabjul
hi everyone, I have done with my PCB Prototyping. I need to Prepare a Bill of Materials(BOM) for my PCB Assembly. I have one doubt regarding selection of SMD Capacitor. -My Question is For Example, I have to use 0.1uF capacitor on my PCB board.In
Electronics Forum | Sat Sep 08 08:55:24 EDT 2007 | davef
We expect to see a copper shadow along the edge of pads when soldering boards with organic solderability protection [OSP]. IPC-A-610 has defined this as acceptable for years. During early reflow stages, the flux in paste dissolves the OSP where ther
Electronics Forum | Sat May 09 11:01:59 EDT 2015 | alphatronique
Hi few year back i design a board for a customer then build pre-production run on my in house line ,all was good then the customer for going into production what to save few $ move to my competitor for assembly this was in late fall then in summe
Electronics Forum | Wed Jul 19 17:34:25 EDT 2000 | Deon Nungaray
Craig, I'd be really hesitant in pursuing this method for a TQFP. Remember, most SMD's are rated for a maximum rising slope of around 4C/Sec. Immersing a fragile TQFP in a hot wave of molten solder will probably exceed this ramp up rate. Besides thi
Electronics Forum | Tue Jul 18 05:39:25 EDT 2006 | rocko
Hello all, After lead-free reflow process of single side assembled PCB I have a problem with a tensile strenght of SMT transformers - I can rip the parts from the board very easily. There is very good component leads wetting (optical inspection)
Electronics Forum | Wed May 16 11:19:08 EDT 2012 | fulgen
Hi Guys, I´m looking for information about processing smt components on flexible printed circuits (printing, SMD assembly,reflow soldering and laser cuting). These flexible circuits comes from a roll of 300 mm width. I found some information about ro
Electronics Forum | Wed Aug 19 05:00:56 EDT 1998 | Tom Blum
Hi there, I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In order to
