Electronics Forum | Thu Oct 19 16:10:44 EDT 2000 | John Thorup
Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.
Electronics Forum | Thu Oct 19 16:10:48 EDT 2000 | John Thorup
Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.
Electronics Forum | Thu Oct 19 12:34:36 EDT 2000 | lwatson
I can't seem to find an article about the limiting mass of a SMT component on the solderside of a double-sided reflowed PCB. I'm pretty sure that Phil Zarrow did an article on this subject. It went something like the mass/land surface area?
Electronics Forum | Wed Dec 10 10:05:07 EST 2003 | davef
We do not have experience soldering to the PVD surface you plan to use. We use Titanium [Ti] stiffeners in wave soldering and our wave equipment manufacturer uses Ti fingers, nozzles, pump blades, and other parts, because solder doesn�t stick to Ti.
Electronics Forum | Fri Jul 15 13:58:32 EDT 2005 | seaK
Our production is putting QFN40 and QFN56 package on board. With 80% opening on terminal, 40% on thermal pad, we found QFN56 100% forming toe fillet, but it does not work out the same to QFN40. We suspect it's because of the weight of component.....
Electronics Forum | Wed Jul 06 14:36:05 EDT 2005 | Bob R.
The only way we can consistently get a toe fillet is to use a paste with an extremely active flux. We allow that paste on certain products, but discourage it's use because it's on the hairy edge of not meeting our lower limit in surface insulation r
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS
Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap
Electronics Forum | Mon Jul 06 13:17:50 EDT 1998 | Upinder Singh
| | Hi all . | | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | | I would appreciate if somebody could help me in the stated issue: | | I am trying to to place one thru hole 20 pin connector along with the SMT components by p
Electronics Forum | Wed Jun 03 15:22:12 EDT 1998 | Greg Curler
| | We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Training Provider / Events Organizer / Association / Non-Profit
6600 City W Pkwy
Eden Prairie, MN USA
Phone: 952-920-7682
.png)
