Electronics Forum | Tue Sep 08 16:18:20 EDT 2009 | proy
We have an Orion which has been running very well. We just started to run production of a board with NO changes from the last run about one month ago. Today, however, the vision system is not recognizing parts. The scan image on the monitor looks goo
Electronics Forum | Thu Sep 22 10:28:48 EDT 2011 | davef
We agree with you. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This could reduce the reliability of your product, somewhat. Flux or gel may be use
Electronics Forum | Fri Nov 09 16:57:27 EST 2001 | davef
Sure, it�s fine to use the proper amount of flux and no solder when reworking BGA. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This undoubtedly
Electronics Forum | Fri Jul 01 20:02:34 EDT 2005 | Tom B
1st Consider the time involved with upgrading and troubleshooting! Is it worth it? With prices of PC's near to nothing, it may prove cheaper and easier just to purchase new system! However, Your last Post mentioned mixing of 100 and 133 Rams! Unl
Electronics Forum | Thu Mar 08 22:35:13 EST 2007 | davef
Suggestions are: * Procure solderable finishes that have sufficient thickness to avoid intermetallic problems and use storage conditions that do not promote oxide growth problems. * Bagging/sealing boards has been shown to extend storage durations i
Electronics Forum | Sat Mar 06 13:34:04 EST 1999 | Earl Moon
| | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | Concerning the BGA stuff, I'm getting about 60% succes
Electronics Forum | Fri Aug 10 13:52:58 EDT 2001 | davef
When you say that glue viscosity changes for lot to lot, is this LOT TO LOT of your product OR Loctite�s product? And when you say that glue viscosity changes, what do you mean [eg, increase by � , decrease by � , er watt?]. What specifically is th
Electronics Forum | Tue Mar 09 22:26:17 EST 2004 | davef
You should to be soldering to the nickel. The intermetallic is Ni3Sn4. "At relatively low temperatures, the tin-nickel layers form about as rapidly as the tin-copper layers do, but at higher temperatures their growth rate is distinctly lower. At 10
Electronics Forum | Wed Jul 14 11:26:51 EDT 2010 | davef
Probably, you need to make the same presentation to your customer that you made to your boss when you proposed changing to low-residue fluxes. Hey boss [customer], here's what's GREAT about low-residue flux. Here's how we can: * Lower our unit cost
Electronics Forum | Sat Mar 06 20:46:21 EST 1999 | Dean
| | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | Concerning the BGA stuff, I'm getting about 60
