Electronics Forum: recomended pads for resistor (Page 1 of 1)

Round pads for 0402's. Is it feasible?

Electronics Forum | Thu Mar 19 12:22:54 EDT 2009 | mhjohnso

While investigating a routing study for a new bga device, I found the vendor used round 20 mil pads on 0402 decoupling caps.This allows fitting the caps between break out vias on their 1mm pitch BGA. Round pad gives about 8 mils diagonally from pin t

Re: Desperately looking for help

Electronics Forum | Wed Dec 13 11:24:08 EST 2000 | Wolfgang Busko

Hi George, bad luck! That�s why we professionals get so much money for it. Those "thingies" are mainly capacitors or resistors. If a capacitor is missing you might with luck not even notice it. A resistor, that�s different, you will notice it, what

Re: Desperately looking for help

Electronics Forum | Wed Dec 13 11:24:10 EST 2000 | Wolfgang Busko

Hi George, bad luck! That�s why we professionals get so much money for it. Those "thingies" are mainly capacitors or resistors. If a capacitor is missing you might with luck not even notice it. A resistor, that�s different, you will notice it, what

Stencil Design for Resistor Net Array 0402

Electronics Forum | Wed Mar 26 17:09:52 EST 2003 | Jos�

For the Resistor Network Array SMT 0402- 8 pads I'm using a Stencil 5 mils Th. with the next appertures : Corners-biggers pads: 24 x 12 mils Center pads : 9 x 24 mils This Appertures are working excelent for the RN's that his appertures are parallel

Stencil Design for Resistor Net Array 0402

Electronics Forum | Wed Mar 26 19:11:52 EST 2003 | russ

Tell us more about your printer. squegge blade type ,speed, snap-off distance etc... You shouldn't have to change apertures for any component based upon its rotation. the parts that are coming out good could they withstand a higher volume print? You

Pad design for SMD Bottomside wave soldering

Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef

First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff

10 Methods for PCB Heat Dissipation

Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076

https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting

Question on Pad Size for ICT Test Points

Electronics Forum | Tue Aug 07 21:17:24 EDT 2001 | davef

This provides LT 3 misses /1M hits. * Probe all points on one side of the board. Bonus => This lower fixture cost. * Test pads and vias: GT 25 thou from other land traces. * Small [LT 5 ohm] resistor measurements: Use two pads at each end and do 4-

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