Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire
Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the
Electronics Forum | Sat Mar 06 06:15:14 EST 2004 | Bryan
Thanks Tommy. In fact I've tried many types of profile,but it didn't work.I'll try to make the peak temp. as low as 205C and dwell long as in some threads Dave said.I've tried baking the BGA and PCB before mounting also dindn't work.yes,I've heard th
Electronics Forum | Tue Apr 13 10:30:52 EDT 2004 | Ken
Threre has been speculation as to voiding as a function of solder paste liquiduous vs. ball liquiduous. Gas entrapment is thought to result if one melts before the other (I forget which order). Two profiles may yield different results as determined
Electronics Forum | Sun Nov 28 03:27:03 EST 2004 | jmedernach
Hi Guy, I see them frequently. Usually, if I have voids on my BGA's, I'll have them on my passives as well as at leaded device solder joints. They run rampant through the entire assembly. For me, it's a function of my profile. I only have a 4 zon
Electronics Forum | Tue Feb 12 18:48:48 EST 2008 | larryd
Thanks for the spare change. Questions are good and I did miss one item. Process has 100% solder paste inspection with a 3D inspection machine that has very few false calls or accepts. Ramp to peak is less than 1.5C/sec. Profile looks good, solder
Electronics Forum | Thu Jul 26 04:26:59 EDT 2018 | Robl
Hi VChauhan, I'll preface this by saying I am no DaveF. Voiding can occur when the flux in the paste boils and vapourises, the expanding vapour needing somewhere to go displaces the paste. So... what we have done in the past: 1) Step the stencil d
Electronics Forum | Tue May 07 10:36:38 EDT 2019 | slthomas
Probably just means you started out with an optimal profile. I suspect that not everyone does. ;) It seems like we did have some luck with profile adjustments in one instance with some QFN's with a large thermal pad. Like I said, though, the profi
Electronics Forum | Mon Jun 14 14:09:23 EDT 2010 | jmedernach
Chris, There are a lot of potential causes for voids. I'll list a few below: a.) cleanliness (or lack there of) b.) Via in pad where said vias are not filled c.) reflow profile design d.) incompatible materials My knee jerk reaction would be to che
Electronics Forum | Tue Feb 02 14:53:56 EST 1999 | Tony
| Hi everybody. | Somebody know any consideration or special care to make a profile for BGA's. | | any advice is aprecied. | | thanks | Al Carrillo | | | | Al, I have been using the same process as Justin recomendations. I have been verry su
Electronics Forum | Wed Oct 04 15:06:57 EDT 2006 | C.K. the Flip
Hmmm.. you are in a pickle then. I have AIM's "Reflow Profile Supplement" where they recommend a Low-Long-Soak (LSS) profile for situations like your's. It's an old-school type profiling approach where you ramp up to 120*C for about 1 min. then soa
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