Electronics Forum | Thu Jul 24 21:20:58 EDT 2008 | srt
Hi, Now we also facing voiding issue after rework .But this only happen to 1 BGA from diffrent PCBA.We also already change 3 type solder paste and fine tune the profile follow solder paste spec but problem intermitten happen again.Pls help to advic
Electronics Forum | Thu Apr 01 14:43:26 EDT 2010 | cbart
You say its in both smt and through hole, but, are you waving the SMT parts as well, I assume yes since you think its dross in the joints. Questions: 1- do you have higher mag scopes that you can zoom in a little more to see if these are voids or dr
Electronics Forum | Thu May 08 19:52:40 EDT 2014 | hegemon
There are many different style LGA packages, but don't sweat it. Stick with the manufacturers recommendations for PWB pad geometry for a start. Voiding can be reduced by careful profiling, and also by pre-tinning the devices. QFN style packages can b
Electronics Forum | Wed Aug 22 16:41:09 EDT 2018 | emeto
To all good suggestions I will add a few other thoughts: 1. Check PCB design(attached). THis mask clearance there is designed so you have some gas escape plan- verify if your PCB design follows that. 2. You can have a long soak reflow profile to re
Electronics Forum | Tue Mar 13 14:17:00 EST 2001 | blair
Thanks a lot for the response 1) there are 8 BGA on this board 6 PBGA, 1 TBGA and 1 ESBGA (metal lid). They are dispersed over the board (approx 11"* 14") 2) Is there a tool to use to understand pitch/bump size and stencil aperture (optimized)? 3) Y
Electronics Forum | Wed Oct 03 13:48:42 EDT 2001 | rocco
hello every body !! We are assembling a new product with some kind of components like (soic)but this component has a metalic surface under the package that works like pin,is a ground terminal,and in the PCB you can see a pad, among the other pads,so
Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip
Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least
Electronics Forum | Tue Feb 12 17:57:42 EST 2008 | chef
I must ask the silly question- are you sure you deposited the correct amount of paste? Depending on aperature design-the voiding could come from a stencil that has its holes partially built up with old paste. If paste volume is guaranteed, then what
Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0
Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
