Electronics Forum | Fri May 21 14:28:59 EDT 1999 | Parvez
hey dave... Abra Ca Babra ...Tony Primavera is my boss here....:) The voids are circular in shape..perfect ones...and they are seen at about 90 % of the joints with vias, and also some at ones with no vias. I am trying to play with the profile...le
Electronics Forum | Wed Sep 01 07:44:36 EDT 2010 | sachu_70
Dear SMT-manufacturer, I would recommend to also have other device joints on board X-ray inspected to understand if void formations are seen across the board or confined only to one component. If seen across, your "Reflow Profile" could be the cause
Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128
Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post
Electronics Forum | Tue May 07 10:13:06 EDT 2019 | cyber_wolf
I have personally never seen a reflow profile change reduce voids. We have invited "experts" in to demonstrate this claim. They were unable to.
Electronics Forum | Mon May 27 04:40:21 EDT 2019 | SMTA-Rogers
Dear Steve, We already to do some DOE of reflow profile, but the optimized parameters are not help for the reduction of voids.
Electronics Forum | Mon May 27 04:46:11 EDT 2019 | SMTA-Rogers
Dear CW, Yes, we also tested many different brands and models of solder paste, under the same stencil design and reflow profile the condition of the voids will have great difference.
Electronics Forum | Sat Jun 01 04:27:37 EDT 2019 | gregoryyork
Increase paste volume and use ramp soak spike profiling. Reducing volume of paste often leads to entrapment. Good idea to know difference between voiding and dewetting due to contamination
Electronics Forum | Tue Jan 14 12:20:33 EST 2020 | cyber_wolf
If you are using standard alloy and flux types and you are within the ballpark of 30-90 seconds above liquidous you should be fine. As I said above unless your profile is grossly off, it is not the cause of your voids.
Electronics Forum | Fri Jan 18 09:35:49 EST 2013 | dyoungquist
Just because a certain profile works good for a board with a BGA does not mean it is automatically the correct profile to use for a different board that contains an LGA. Have you run a separate profile check with the board containing the LGA?
Electronics Forum | Sun Jul 27 19:37:15 EDT 2008 | srt
yup,only happen on PBGA .we alreary follow the solder paste profile.
