Electronics Forum | Sat Aug 26 13:49:38 EDT 2006 | say
Danny, with the Heller 1800 series oven, what is the standard oven profile for lead free. I am having some proble profiling boards with BGA. I am getting alot of voids. If you have a profile for a Heller 1800 nine zone, could you please send me a
Electronics Forum | Fri Jan 12 12:38:57 EST 2007 | maddog
Do you have any pointers concerning the oven setup and profile if you are soldering a module with bottom connections and gold pads to a pwb with an OSB finish? The solder paste is SnPb, no-clean. The paste mfgr. recommended profile produces voiding
Electronics Forum | Wed Nov 05 13:34:24 EST 2008 | ed_faranda
Exactly what should I look at in my reflow profile? Soak Times, TAL, Peek?!? I am right in the middle of the manufacturing specifications as far as my profile goes.
Electronics Forum | Sat May 30 01:31:49 EDT 2009 | mika
make 4 square rounded corner apertures on the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. Don't worry to much of the void's. Just following my tips and you will be fine. The
Electronics Forum | Fri Apr 23 16:19:17 EDT 1999 | Todd
We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using a
Electronics Forum | Thu Jan 11 00:52:12 EST 2007 | behrsam
Mario, I tried a couple of profiles. In all cases the preheat ramps fairly slow, while the reflow utilizes the radiative heater to speed to reflow as quick as possible. I tried a quick profile and a slower one. The quick has about 15-20 sec at pre
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Tue Jan 18 12:44:24 EST 2000 | Russ
I have found that reducing the amount of metal in the joint makes a difference, we have reduced the aperture sizes to provide a minimal amount of paste. just enough to hold the part during handling. You may also want to try and slow the initial ram
Electronics Forum | Fri Aug 10 13:09:49 EDT 2001 | Hussman
Hey Wister, Assuming you are talking about BGA voids, and you just want to try and optimize your profile, you could try a "straight ramp profie". This is where the soak temp is constantly being elivated until you hit reflow. I find this helped me
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