Electronics Forum | Tue Aug 25 10:38:03 EDT 2009 | grahamcooper22
Hi Sergey, Do you know the Moisture Sensitivity Level of the component ? This is normally recorded on the DRY PACK that the device comes in. It is not unusual for a device to POP CORN and still work in test. It depends how much damage there is to th
Electronics Forum | Fri Mar 25 05:33:18 EDT 2011 | Nigel, RAKON
We have the occasional solder fine but the main issue I have is with small - large balls of solder around an 0402 capacitor. Our LF paste data sheet states a %rH of 25 - 70, I have recorded an average for March of 14.9 - 38.5 %rH. Every other requirm
Electronics Forum | Fri Jun 03 05:38:54 EDT 2011 | grahamcooper22
Ideally the MSL should be recorded on the label on the DRY PACK that you receive the devices in....that's the protocol the device manufacturers / distributors should use to help your goods in and shop floor personnel know which are/are not moisture
Electronics Forum | Fri Mar 02 10:25:42 EST 2012 | caerleon
It depends on your companys position. Are you a Sub Contract Manufacturer or an OEM? I dont have any experience with those parts you mention, but from the list and knowing the systems i would recommend the Fuji everytime as im an CP4/CP6/IP3 as I w
Electronics Forum | Fri Jun 21 11:42:12 EDT 2013 | hegemon
It is an audit of every assembly process. Think of how ISO 9001 or 13485(for Medical Devices) might go through your Quality system, documentation, training records, etc. and apply that scenario to your actual processes and documentation of the same.
Electronics Forum | Wed Feb 11 16:38:20 EST 2015 | barryg
I was curious what others in pcb assembly are doing as far as profiling. Is profiling an important part of the smt process? Should every board type processed be profiled to determine optimum oven temps per paste recommendations.Is it ok to assume tha
Electronics Forum | Tue Dec 08 11:18:30 EST 2015 | emeto
Hello all, we are using Circuitcam for all our internal records and programming our production machines. When I auto assign labels for my reference designators, machine will create designators with different sizes(some of them are too small to see i
Electronics Forum | Thu Apr 05 05:37:43 EDT 2018 | balachandran
Recently we have seen the BGA Ball collapsing issue in the field. The unit has the clean manufacturing records at factory, But in the same unit we did the cross section and found Ball explosion only in VDD and VDDQ pins. Can anyone help me to underst
Electronics Forum | Thu Aug 09 10:39:22 EDT 2018 | slthomas
#2, and for the record I'd rather see the occasional off color remark than 2 year old "who's the best overseas pcb supplier" threads being perpetually updated with the same nonsense. I know I can just ignore them, but I don't. I HAVE to look at the
Electronics Forum | Mon Sep 23 11:13:12 EDT 2019 | tsauve
I forgot to update this. Customer insisted on reflowing SIM card directly to PCB, as per their previous CEM. It worked. No deformation of the SIM card - assembly works - records data to SIM card. Note that using hot air reflow type (rework station)d
