Electronics Forum | Thu Apr 15 11:15:30 EDT 2004 | patrickbruneel
Pure (red) copper oxide is green, its not a residue its just oxidation. In your case water and heat will accelerate the oxidation process of unplated or unprotected pure copper. The best way to avoid this from happening is use a socket with tin or n
Electronics Forum | Mon Aug 13 08:04:43 EDT 2007 | davef
Search the fine SMTnet Archives [on gold finger], while you're waiting for others to reply. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=42759
Electronics Forum | Thu Jul 20 05:04:30 EDT 2006 | bing007
We had a similar problem with gold contact pads. Cleanliness is paramount. If you are using foil tensioning system, wash the foil in a stencil wash before use as the cardboard cassettes may be contaminated. Be very careful when loading into a frame f
Electronics Forum | Thu Nov 09 23:27:53 EST 2000 | Craig
We are considering using gold plating on our fine pitch pcbs (as oppossed to HASL). We have heard of long term solder reliability problems with joint imbrittlment how bad is this and does it apply for all of the different plating processes the same?
Electronics Forum | Sun Jul 26 20:56:43 EDT 1998 | Masdi Muhammad
We are trying to reduce the number of units fail at system test due to flux on gold finger. We know so far that the flux is deposited onto the goldfinger during touch-up or rework and to reduce the contamination we are planning to implement 'tapin
Electronics Forum | Fri Oct 05 18:59:53 EDT 2001 | Dan Steffler
I have had an issue where solder has contaminated gold plated pads (fingers) where it is not acceptable. The pads must remain perfectly coplaniar for a LCD zebra strip to lay accross them. Does anyone know of a way to remove the marriage level of s
Electronics Forum | Thu Oct 28 18:14:51 EDT 1999 | John Thorup
Try looking for paste contamination somewhere. Dirty stencil, printer table or fixtures. Placement table/fixtures. Reflow belt/conveyer. Reuseable finger covers, if used. Try covering the fingers with Kapton tape during different stages of the proc
Electronics Forum | Mon Jul 27 17:09:20 EDT 1998 | Rin
| We are trying to reduce the number of units fail at system test due to flux on gold finger. We know so far that the flux is deposited onto the | goldfinger during touch-up or rework and to reduce the contamination we are | planning to imp
Electronics Forum | Mon May 18 17:59:06 EDT 1998 | Richard Jackson
I've tried every thing I can think of. Do you have any Ideas? What I have is micro balls on the gold fingers of panelize boards. These balls only appear on the gold finger. Or at least I can only find them on the gold fingers. What I have tried so
Electronics Forum | Sun Jul 26 22:35:55 EDT 1998 | D.Lange
Masdi, Try board shunts. They are hi-temp rubber strips with grooves cut. They can be popped on and off with ease and are much faster than taping and considerably cheaper. They also work great for masking goldfingers prior to wave soldering. Contac
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