Electronics Forum | Thu Sep 15 20:44:09 EDT 2016 | souldierann
Guys, i hope you can help me in finding the reason why DUT pad like the photo attached had wearing out. Highlighted in RED is the wearing out issue. Thank you so much
Electronics Forum | Fri Sep 06 11:16:08 EDT 2002 | dason_c
To check any solder crack, open under the BGA/CCGA. I am using a destruction test to find out is it related to the reflow profile or the Fab issue. 1. Depense the Dye (I use Dykem Steel Red) under the device. 2. Cure the dye 3. Remove the device 4.
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Mon Aug 05 14:13:09 EDT 2013 | rway
I haven't done this either but have an idea of how I would address it. First, let me ask, are your leads crimped or straight? Most likely they are crimped which means you should get reflection from the lead. You could try a solder inspection (reve
Electronics Forum | Wed Jul 19 20:48:05 EDT 2000 | Dave F
Craig: Waving TSOP should be your last choice. You should resist will high levels of red faced, neck vein bulging seriousness. After you loose: * Philips pads are a good starting point. * Recognize you'll probably have to lay-out the pads on the b
Electronics Forum | Thu Feb 27 18:07:13 EST 2014 | emesystems
The ISL12020 real time clock comes in a 20 lead DFN, and includes a 32kHz crystal in the package. The terminals of the crystal and oscillator come out to external pads and are highly susceptible to leakage to the neighboring power supply pins. With
Electronics Forum | Thu May 26 13:13:20 EDT 2011 | blnorman
Hopefully the experts can help you out. I can just say you have to be very careful not to get the adhesive on the pads. So I can understand making sure there is enough distance between pads so the adhesive doesn't interfere, not sure about increasi
Electronics Forum | Wed Feb 18 21:53:08 EST 1998 | Bill Fluegel
| do a good edit on the smt machines | | WE have a problem of tomb stoning in our smd assemblies during curing process of the boards in our Infra Red Soldering bath. Would you like to give us solution how to resove this proble? | | Thankyou | | Rega
Electronics Forum | Tue Nov 04 12:58:17 EST 2008 | smt123
I have to agree with Patrick here. This image appears to show a board that is NOT HASL as there is what appears to be a copper pad in the upper portion of the image. But then again the arrow tip appears to be white and I woudl expect that to be red s
Electronics Forum | Thu May 26 11:21:14 EDT 2011 | asksmt
Hello Guru's, I am using IPC-7351 LP Calulator to design Footprint (0603, 0805, 1206, SOT-23, etc) for all SMT Parts. Our Production Recently commented that they have included Red Glue Machine inhouse and will use Wave Soldering for Both Thru-hol
