Electronics Forum | Tue Feb 11 15:54:23 EST 2003 | Jodi Roepsch
I am interested in knowing if anyone has new information about the black pad defect with ENIG plating. I am interested in it from the viewpoint of risk assessment, testing done on final product to isolate failures,and root cause of the defect. Than
Electronics Forum | Mon Mar 17 18:11:32 EST 2003 | davef
Converting to immersion silver is the best solution to the "black pad problem".
Electronics Forum | Tue Mar 11 08:33:31 EST 2003 | davef
SMTA [www.smta.org] New On-line Presentation - March 14 Dealing with the Black Pad Defect in Manufacturing Solectron Vice President of Technology Srinivas Rao And Director of Process Integration Kim Hyland Date: Friday, March 14 Time: 10:30AM - Noon
Electronics Forum | Mon Mar 17 15:32:33 EST 2003 | Jodi Roepsch
Thanks to everyone who took my question seriously and made an effort to share information on this topic. I have done extensive literature searches on this topic in the past but am still looking for more information regarding how this defect affects
Electronics Forum | Wed Feb 12 09:42:46 EST 2003 | genny
The issue is on the web. The current issue is February, so check for past issues at http://www.circuitsassembly.com/
Electronics Forum | Thu Feb 20 10:48:01 EST 2003 | bernard
Hi Jodi, You helped write the circuit assembly article , so why the question ?
Electronics Forum | Thu Feb 20 16:30:36 EST 2003 | larryk
Maybe she wanted everyone to read her article?
Electronics Forum | Fri Mar 14 14:55:48 EST 2003 | Paul.malone@teradyne.com
What current desity package would you draw the line for the use of ENIG (imm. IO count/ etc
Electronics Forum | Wed Apr 02 23:21:24 EST 2003 | scottf
Make the move to Silver Immersion, no nickel to mess with!
Electronics Forum | Wed Mar 19 19:02:39 EST 2003 | Jodi Roepsch
From my experience, we have had little success in reworking boards with the black pad condition. In one instance, with several reworks, we were able to get plated through holes with the defect to take solder but the joint reliability was highly ques
