Electronics Forum | Fri Nov 17 16:24:18 EST 2006 | billwestiet
I'm in North Attleboro, small world. To answer your question, you can deposit small dots of paste with a syringe. Kind of tricky work, and there are small stencil soluions out there fairly inexpensively. See http://www.minimicrostencil.com/ (I do
Electronics Forum | Wed Nov 29 20:32:08 EST 2000 | irwanm
I'm new in SMT and the company I'm working with has already purchased SMFL-3000 manual pick & place system with hot air and we don't have reflow oven. We are now starting design SMT board. My question is, how we reflow the solder? After all component
Electronics Forum | Fri Nov 19 13:07:01 EST 2010 | vmorina
Hello everyone, Talking to my boss today I was able to determine what we're really looking for in terms of reflow soldering. The company is not looking to do a volume run; we're trying to solder chips for prototype boards, which are currently done w
Electronics Forum | Thu Aug 05 11:27:43 EDT 1999 | Wolfgang Busko
| | We are installing a new reflow oven and I have been told that we do not need to vent the exhaust out through the roof since we have a false ceiling. All that is required is to vent above the false ceiling and that the air exchange is great enough
Electronics Forum | Mon Jul 27 13:59:11 EDT 1998 | Robert Steltman
We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutectic balls Refl
Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis
There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Wed Dec 25 02:42:15 EST 2019 | sssamw
Yes, the barycenter causes drop off since only leads at one side, so a variation of re-flow oven, such as vibration or hot air flow, low re-flow time could help a little. So, how you solve this issue after many months?
