Electronics Forum | Fri Aug 01 02:10:26 EDT 2008 | fowlerchang
Pad design is not only the size of pad but also the distance between two pad. N2 will increase tombstone as we tested. 10 zones reflow oven and slow temperature ramp will reduce this defect. MustII is the equipment which is used to test the solderabi
Electronics Forum | Mon May 05 18:48:23 EDT 2003 | Kris
Hi, It is expected that lead-free will have reduced tomstoning. As it has a higher surface tension and does not wet as well as the tinlead paste it exibit lower tombstoning. Addiotnaly commercialy available lead-free alloys may not be true eutectic
Electronics Forum | Wed Jul 25 11:16:34 EDT 2007 | lloyd
Hi Folks, I hope someone can help me, Is the homeplate stencil design (for reduced solder paste) the same for preventing solder balls as it is for reducing tombstones? i.e. the reduction of solder paste under the component termination. I'm trying to
Electronics Forum | Thu Aug 17 12:18:40 EDT 2017 | cyber_wolf
I do not see anything obvious that would cause a thermal mis match. Regarding reflow profiles reducing tombstoning, Unless there is something wrong with your paste or you are running smaller than 0402's, I have NEVER seen a reflow profile reduce tom
Electronics Forum | Fri May 30 11:23:10 EDT 2003 | dsuraski
AIM has an article that includes anti-tombstoning solder paste information. It's called "Reducing The Tombstoning of Small Discrete Components" and is located at http://www.aimsolder.com/technical_articles.cfm#14 Or I can send a copy to anyone inte
Electronics Forum | Wed Nov 01 14:42:17 EST 2000 | MRMAINT
We had some similar issues on one of our products.The oven profile is critical. We found that with a gradual soak ramp up it took care of about 80% of the tombstoning.The other thing that we found was pad design issues. Take a look at the sept. issu
Electronics Forum | Wed Aug 05 20:48:50 EDT 1998 | Ron Costa
I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has anyon
Electronics Forum | Wed May 31 17:37:29 EDT 2000 | Arturo
I�m also having this problem with Panasonic film capacitor. Even when I have the correct pad size according to Panasonic data sheet the tombstoning occur. I am thinking that the problem could be the plating of the film capacitor. The only way I could
Electronics Forum | Thu May 29 15:00:49 EDT 2008 | slthomas
We've found that reverse homeplate reduces tombstoning significantly for us on 0603 and 0402 (the latter of which we hardly ever see).
Electronics Forum | Wed Jul 01 08:15:13 EDT 2009 | dwelch123
You can use regular paste and a .005 stencil will help reduce tombstones. It's just that easy. I run 0402's all the time without any problem, just make sure your profile is a good one!
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