Electronics Forum | Thu Jun 08 18:19:40 EDT 2017 | edhare
Jeff, You might look at this paper, which has some background & references that are relevant to your question ... http://www.semlab.com/papers/diffusionbarrierplatinginelectronics.pdf Ed Hare
Electronics Forum | Mon Aug 09 13:02:47 EDT 2010 | Dennis O'Donnell
I'm available in the SF Bay Area. Check out my LinkedIn Profile to see my background and customer references here: http://www.linkedin.com/in/dennisodonnell Web site info here: http://www.pcb-repair.com/consulting_services.htm
Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef
There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio
Electronics Forum | Mon Feb 14 16:32:13 EST 2011 | kmadison
Looking for someone with a background in Furnace Sales i.e. a retired BTU, SierraTherm, RTC, WJ, you name it sales person. Part time - full time Must be able to cross reference all makes for best fit with customers profile requirements.
Electronics Forum | Tue May 01 12:16:25 EDT 2001 | kaoni
I really appreciate your advice. Dave did not offer much in the way of real advice, his response was mostly diatribe. I am looking at visual inspection at this time as AOI might be overkill in my case. I believe that it, in combination with the machi
Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri
Electronics Forum | Mon Mar 24 22:53:22 EDT 2008 | davef
As you say, just about defect can be tied to process, one way or another. If you want to think about it, search the fine SMTnet Archives for background on barrel cracking. Other things are: * How thick is the actual via plating from the two supplier
Electronics Forum | Wed Jun 26 08:52:03 EDT 2002 | davef
There is no industry standard for reballing BGA. Search the fine SMTnet Archives for a reference to Motorola�s reasoning behind their not shipping product with reworked BGA. As background: * JEDEC is the semiconductor engineering standardization gr
Electronics Forum | Fri Nov 19 14:50:46 EST 1999 | nick mata
If you are seeing reflection on the underside of the part, I would first begin with the recommended light levels for the BGA. You should be able to obtain the levels from the Siemens help desk. There is a 2 to 3 page document with levels for a variet
Electronics Forum | Sat Mar 06 08:19:50 EST 1999 | Dave F
| Clarissa, | | Dave had good suggestions. We load several boards manual at this time. We set our components up in clearly marked bins. The documentation includes a chart with the part number, bin number, reference designator and color code for t
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