Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas
hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a
Electronics Forum | Tue Feb 15 09:27:34 EST 2000 | Casey Scheu
Sal, This is a common problem experienced by several OEM's. It all comes down to heat. This is why the problem is corrected on your repair unit. I would suggest using a Slim Kic or Data Pac (mole) to thermal couple the IC prior to the reflow oven.
Electronics Forum | Fri Feb 11 14:32:44 EST 2000 | Ashok Dhawan
I am looking for a Masking tape for Gold fingers on a PCB . It should not leave any residue on reflow soldering ( 220 deg c). Currently, I am using Kapton tape with Silicon adhesive. It is leaving minute quantities of residue? The fingers are al
Electronics Forum | Thu Feb 10 09:43:42 EST 2000 | Glenn Robertson
Russ - I agree with Dave and Wolfgang that the boards are the top suspect. The idea of "rework" from Gold to HASL sounds scary. Are you sure the Gold is electroplate and not immersion? Resolve that and then check the archives for "dark pad" or
Electronics Forum | Fri Dec 22 12:17:02 EST 2000 | vickij
Hi! Has anyone out there ever tried to use a high-temp and a low-temp solder paste on a double-sided board without using an adhesive? (Populate the bottom side with the high temp paste, reflow, turn it over, then run the top side). I looked in the
Electronics Forum | Tue Dec 26 11:09:16 EST 2000 | acahill
High temp paste or not, I feel it's all up to the oven,and/or the stencil design. are there sufficient solder joints, before running the opposite side (are the apertures large enough to achieve a hardy fillet or to small, allowing enough paste to vis
Electronics Forum | Tue Dec 26 15:22:43 EST 2000 | Hussman
Vickij, Why not try using regular temp. paste for both sides? Unless you have some real heavy parts on both sides, you can run a double-sided reflow process with most boards. I myself like to place R's and C's first (or bottom side) and then do an
Electronics Forum | Thu Dec 21 14:29:08 EST 2000 | CEFD
There must be a good reason for somebody to say that; I just can't think of one. We have a CRT and there is an issue with flux affecting the performance of the machine, but it is not terribly bad. Run your reflow profile the way it is supposed to run
Electronics Forum | Fri Dec 15 15:59:35 EST 2000 | Hussman
Dave, It will all be about the same - changing atmospheres does not affect your heater output. You may experience some differences in the way your solder joints look (a little duller), but with some of the newer pastes out there, you can overcome i
Electronics Forum | Wed Dec 13 10:24:52 EST 2000 | Wolfgang Busko
Hi Jack, I once tried this finish ( without changing any process parameters ) and encountered wetting problems even in the first reflow process. It was thought as cheaper alternative to Ni/Au we use for planarity reasons. Heard of the same problems
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