Electronics Forum: reflow (Page 650 of 946)

Re: Convection Oven Reflow Modeling Simulations

Electronics Forum | Thu Feb 17 22:23:15 EST 2000 | Dave F

Richard: As Roni said, most of the better profiler companies have the capabilties you seek Datapaq,187 BallardvilleSt,Wilmington, MA 01887 508.988.9000 Michael Dougherty Electronic Controls Design, 13626 SFreeman Rd, MulinoOR 97042 503.829.9108 K

Stencil design for dpack

Electronics Forum | Fri Jan 19 06:52:36 EST 2001 | pteerink

We have had the same problem with several boards, and the problem was with the land pattern design on the PCB, not the stencil. We found that the part tends to center itself on the one large pad, and if the two smaller pads are not the right distance

Reflow soldering through hole parts

Electronics Forum | Tue Jan 30 12:03:15 EST 2001 | slthomas

Pete, I'm wondering how much optimisation you needed (or were allowed) to do with respect to connector design. The first one we evaluated had a row of leads that I can only describe as "crescent" shaped in cross section. Impossible to get even 50%

Info on the Data Paq Reflow Tracker

Electronics Forum | Wed Feb 21 09:01:16 EST 2001 | Donnie

Thanks for the input. We currently have both the Waverider and Kic products in house. We use the WaveRider on all our waves, and the Kic for the ovens. We want to find a product for our ovens that's a little more up to date than the Kic. I'm looking

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 20:01:39 EST 2001 | davef

I�m unclear about the intent of your question, but I�ll take a pass at it regardless. I second the previous poster's commets. [Ya, that's the ticket.] Most chip attach adhesives should not be cured at typical reflow profile temperatures. Check yo

Insert Molded Terminal Selective Soldering

Electronics Forum | Mon Feb 26 14:39:34 EST 2001 | John

We are developing a new product that will have hand placed through hole parts and double sided smt. This assembly will eventually be soldered to a plastic cover that has 15 insert molded terminals. The cover extends below the surface of the board,

Electrolytic solder

Electronics Forum | Tue Mar 20 20:14:40 EST 2001 | davef

Electroplating [electrolytic] and dipping [HASL] are the two methods for applying solder coatings to features on boards. Disadvantages of electroplating lead / tin are: * "Weak knees" created at the edge of plated through holes. [I used to get weak k

AOI systems

Electronics Forum | Fri Mar 30 07:14:42 EST 2001 | pteerink

Genny, Xray systems ( or at least what I have seen ) are a manual based system. That is, you put the board on the machine and look at certain locations that you want to inspect. What we have in mind is an automated system that will catch obvious, no

AOI systems

Electronics Forum | Fri Mar 30 07:14:51 EST 2001 | pteerink

Genny, Xray systems ( or at least what I have seen ) are a manual based system. That is, you put the board on the machine and look at certain locations that you want to inspect. What we have in mind is an automated system that will catch obvious, no

THERMAL PROFILING

Electronics Forum | Thu Apr 12 03:55:06 EDT 2001 | surachai

Dear anyone ; Every time that we run profile now ,we will create profile from recommendation of vendor flux and the some critical parameters such as thermal shock or others ... but I don't know that Do you ever create standard profile to be procedure


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