Electronics Forum | Thu Jul 05 06:38:35 EDT 2001 | Danial
Thanx Dave, I agree with you on the planning part...yapp!! the same guy who've thrown an old datecode components to me..now they did it again on the PCB. Well Dave, could you explain a little bit more about the "hi-test flux" that you mentioned ab
Electronics Forum | Thu Jul 05 10:45:01 EDT 2001 | dougie
Steven, There is a load of info on this if you check through the archives. Quick pointer though are: Solder balls are caused by paste creeping under the component at placement. The part is placed and the paste is squashed under the component, when t
Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
Electronics Forum | Thu Jul 12 10:45:42 EDT 2001 | Hussman
Since your customer is complaining, you'd better be pro-active. Doesn't mean they're right, but without customers, life sux alittle. Anyway, ask them for a profile of the 5 reflow processes. If they don't have that and you have a profiler, ask if
Electronics Forum | Mon Jul 16 22:40:02 EDT 2001 | davef
Speaking of people we'd like to pimp slap, why did the not-so-quality guy decide to ship defective units, anywho? This sorta says we can't blame the customer any longer. So, it's either blame the fabricator or umm er, sorry to say this ... YOU DL,
Electronics Forum | Wed Aug 15 18:16:15 EDT 2001 | Shindler
Hi Larry- Be wary of which IR systems you use, dark IR (ERSA) maintains only the positive effects of infrared use in that this infrared medium wavelength has the optimal absorbtion/reflection ratio between light and dark colors. Therby, guaranteeing
Electronics Forum | Thu Jul 26 13:49:48 EDT 2001 | johnmaetta
That's a good question. On some of the assemblies that our engineers test, appear to have been reworked in these suspect locations. I have requested rework data from our CM by providing them with assembly and serial numbers. Their data shows that th
Electronics Forum | Thu Jul 26 14:06:46 EDT 2001 | johnmaetta
That's a good question. On some of the assemblies that our engineers test, appear to have been reworked in these suspect locations. I have requested rework data from our CM by providing them with assembly and serial numbers. Their data shows that th
Electronics Forum | Mon Jul 30 10:44:37 EDT 2001 | hinerman
A few of the more common defects If bridging or insuffienct deposits occur on the printer, one of the first things to check is the tooling. Misplaced hard tooling pins or poorly designed fixtures have a nasty habit of breaking components on side
Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter
I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you
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