Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ
Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to
Electronics Forum | Tue Nov 30 21:23:55 EST 1999 | cklau
hello; When we are doing component land pattern design , one thing will always be in our mind; that is the basic criteria or common land pattern design guideline for reflow and flow solder assemblies. For basic fomula in calculating resistors are:
Electronics Forum | Wed Dec 01 22:34:32 EST 1999 | Dave F
Mark: Ralph Woodgate is a "god" of solderability control programs. We have: � Been attending his seminars for, maybe 8 to 10 years ... who keeps track when you�ve been breathin� fumes that long? � Three different editions of his "Handbook Of Machi
Electronics Forum | Fri Nov 26 09:13:10 EST 1999 | Wolfgang Busko
Jeff, Ted, Stefano What Stefano is saying sounds reasonable. With entry-level systems its always a struggle to get sufficient results. The operators golden hand is needed. Better controlled advanced dispensing systems should do the work, unluckily I
Electronics Forum | Thu Nov 11 10:49:13 EST 1999 | John Thorup
Hi Jim All the major players make soldering iron testers that will test temperature, stability, ground leakag and other parameters. WellerWA2000 Hexacon G210-G310 Edsyn MS410-MS412 Bonkote MCA700 Pace P/N8001 and others There is no particular reason
Electronics Forum | Mon Oct 25 14:48:29 EDT 1999 | William
All, I am having a problem with joints being soft after SMT. Especially 25 mil and smaller parts. It seems as though you can slide the leads right off of the solder. It takes only about 30-40 oz. of compression at 45 deg. to move leads off of join
Electronics Forum | Wed Oct 27 16:55:38 EDT 1999 | Joe Herz
Jerry, In our house we generally run a glue bottom last but people do it both ways. Our logic revolves around protecting components from being knocked off the board during handling and processing prior to wave solder (this is most important with sm
Electronics Forum | Tue Oct 12 16:08:44 EDT 1999 | Brian
| I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).
Electronics Forum | Sat Oct 09 09:50:04 EDT 1999 | Ken Fong
Hi, We are using mixed technology in our PCBA. Would like to know whether there is any criteria governing/guiding the use of mixed technology in such aspects as: 1. Some SMDs cannot be used in some kind of PCB materials such as FR1? 2. Some SMDs are
Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian
| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |
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