Electronics Forum | Tue May 27 10:34:30 EDT 2003 | davef
Much of the ability to survive rework or thermal excursions is dependent upon the fabrication materials. The board qualification criteria under the 55110 was designed around 5 thermal heat cycles. Consider reworking a BGA in this context. BGA i
Electronics Forum | Wed Sep 02 19:08:45 EDT 2009 | jlawson
Also consider electroltyics as some brands can only cope with one pass through reflow, 2 max. In Vapor phase 1 pass max is typical. Although depends on makers specs and what they say the device can withstand. main issue is Dielectrics get damaged , c
Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper
we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i
Electronics Forum | Tue May 27 19:21:50 EDT 2003 | bayanbaru
Can I then say that in general boards are not encourage to rework more than 3 times since the boards will be subjected to Top and Bottom reflow? What is 55110?
Electronics Forum | Thu Apr 19 11:45:34 EDT 2007 | Cal
Hi PeteB... I dont think you will find any Specs...but that I do not know. What I do know is it depends on the make up of your PCB and Components. Obvious haveing components that may be sensitive to heat the less you want to run or pass through. Re
Electronics Forum | Fri Aug 21 04:37:26 EDT 2009 | grahamcooper22
Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance.
Electronics Forum | Thu Sep 03 11:18:04 EDT 2009 | dyoungquist
We do not have any electrolytic capacitors on this board.
Electronics Forum | Tue Aug 18 17:49:16 EDT 2009 | dyoungquist
Is there a limit to how many times a pcb with components can be run through a reflow oven before the components start to degrade? Example: We load the SMT components on the bottom side of the pcb and run it through the reflow oven. Next we load the
Electronics Forum | Thu Sep 03 08:39:53 EDT 2009 | markhoch
I'd be more concerned with the pcb itself then I would be with standard SMT components. Are you using a PCB with a high Tg? (170 degrees C or greater)
Electronics Forum | Thu Sep 03 11:38:28 EDT 2009 | dyoungquist
I'd be more concerned with the pcb itself then I > would be with standard SMT components. Are you > using a PCB with a high Tg? (170 degrees C or > greater) The circuit board material is NP-170B (Nan Ya Plastics Corporation). It has a Tg of 170
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