Electronics Forum | Mon Jul 27 13:59:11 EDT 1998 | Robert Steltman
We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutectic balls Refl
Electronics Forum | Tue Jul 28 17:37:00 EDT 1998 | Robert Steltman
| Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface und
Electronics Forum | Sat Jan 06 05:17:16 EST 2007 | shrikant_borkar
Hi. How one Can suggest you unless your Involment in your Process? Check Following Points and also Is Reflow Temp - Profile is as Per Glue Mfg. Requirment Are Glue Dot in Sysmetricl Position? Is glue sufficient , below IC to hold ? please visit th
Electronics Forum | Thu Oct 13 18:20:14 EDT 2022 | proceng1
I also believe it is the cause of the issue. I guess you could make a fixture that clamps the board flat. Then you'd have to change the reflow recipe. How was the recipe created? Did you actually profile a populated board or just use a recipe that
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Wed Jan 14 08:28:15 EST 1998 | Allison
Contact your solder paste manufacturer and get the reflow profile recommended for that particular paste. Then, duplicate that reflow profile on your oven. You will need to use thermocouples. You may have to tweak this profile a little. | We use no
Electronics Forum | Tue Dec 28 12:55:16 EST 1999 | Justin Medernach
Greg, The best advice that I can give you is a PBGA will respond just like any other surface mount package. There may be a 5 degree delta between a PBGA 356 and a QFP208 but the two respond very similarly in the convection reflow environment. CBGAs
Electronics Forum | Thu Feb 22 05:32:32 EST 2007 | lococost
Those guys didnt suggest you get in there and check did they Mr Wavemaster?
Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis
There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======
Electronics Forum | Tue Jan 22 20:37:48 EST 2002 | davef
Try: * Searching the fine SMTnet Archives. We have ground profiling, thermocouple attach, etc. to pulps. * Buying [ http://www.ipc.org ] IPC-7530 - Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)
