Electronics Forum | Mon Feb 12 13:15:14 EST 2007 | realchunks
Does this meet the SMQ230 recommended time above liquidous? Do you have any parts that cannot withstand 239 degress C? If meet SMQ230's recommended time and temps and your parts are rated for this temp, then you should be OK. The real proof is ref
Electronics Forum | Mon Feb 19 08:00:46 EST 2007 | ck_the_flip
Darby, thanks for the good info. I actually read an article is Circuits Ass'y that a more rapid cooling rate results in "better diffused tin rich clusters" resulting in better grain structure. But...this article was written by an Oven manfuacturer
Electronics Forum | Mon Feb 19 08:18:03 EST 2007 | realchunks
That's why you have to read between the lines of any article. Even with data from a paste manufacturer, it's still a bit fuzzy on how their paste will actually work. Not many companies have their data that solid, so it's better to experiment and me
Electronics Forum | Wed Sep 15 07:43:12 EDT 1999 | Earl Moon
| Hi, | | Can someone pls suggest to me the best reflow temperature setting | for a force air convection oven. The details is as follow. | 1) Heller 1700s | 2) 12 zone---6 top and 6 bot | 3) Solder paste --- Qualitek 691 non clean | 4) board size :
Electronics Forum | Wed Sep 15 10:55:21 EDT 1999 | Scott S. Snider
| Hi, | | Can someone pls suggest to me the best reflow temperature setting | for a force air convection oven. The details is as follow. | 1) Heller 1700s | 2) 12 zone---6 top and 6 bot | 3) Solder paste --- Qualitek 691 non clean | 4) board size :
Electronics Forum | Tue Jan 22 18:53:37 EST 2002 | barry
Hi all, or anyone. We recently purchased some smd equip. to do our own inhouse assy. Though we did purchase a training package it was short and sweet. What I was wonderin is their any tips on oven profiling, we were told that 90% of our product would
Electronics Forum | Thu Aug 19 08:22:05 EDT 2004 | Rafal M.
Hello. I have a problem with reflow soldering of PCBs with golden pads. Peste explodes in the oven. I don't know in witch phase of process (in what point of profile) it happens. It's the reason of problems with golden pads - it's dirty when going out
Electronics Forum | Thu Apr 05 12:27:12 EDT 2001 | davef
I concur with your second approach. A profile needs to be tailored to the design of the board, the components, and the solder paste. Your first approach seems to try to balance lower quality soldering with a lower process complexity.
Electronics Forum | Thu Jan 16 10:18:53 EST 2003 | burb1999
I have heard that the profiles are pretty much the same but I have a visible solder joint difference... might half to start looking at the plating, might be something with that?
Electronics Forum | Thu Jun 14 04:08:33 EDT 2007 | d0min0
we had same problems with heavy loaded boards (40 x 10 leg transformer each side) we placed 2 glue dots (Fuji GL)under trafo and played with profile bottom side (thermateh lcv4 - 6 zones, SnPb process) that did the trick
