Electronics Forum | Fri Sep 05 04:21:37 EDT 2008 | aj
Hi all, If you are profiling a pcb that has a wide variety of comonpenents with varying temperature sensitivity requirements what do you do? e.g. 1136 ball BGA with min reflow temp 245 with tsop48 with max reflow temp 235 etc. rgd's aj
Electronics Forum | Mon Mar 21 12:43:20 EDT 2011 | hegemon
Passives first reflow, and BGAs second side reflow. Uses only one heating cycle for your BGAs, and the passives will stay in place just fine given correct profile parameters. There are a few exceptions, but this is generally how it is done. My $.02
Electronics Forum | Thu Mar 21 22:46:37 EDT 2013 | padawanlinuxero
Do you have the thermal profile? Once I invited my nephew to my work and saw the reflow oven and saw how it work and the first questions was : "can we make a pizza uncle?" :o) I always try to do just that even with a small amount of dough :o)
Electronics Forum | Mon Jun 07 15:33:08 EDT 2010 | bderks
Hi, I'm working at a very small electronics assembly firm and we need to get a better thermal profile of our reflow and solder wave ovens. Our firm is part of a larger firm that was set up to help handicapped people find work in the Netherlands. Yo
Electronics Forum | Wed Sep 29 12:51:55 EDT 1999 | Bob Barr
Never heard of the DRS-22C. I have had a DRS-22 for several years now. Purchased it when we started doing BGA's. The operators like it - good optics (split view), built like a tank, X-Y table easy to manipulate for alignment. I like it because I ca
Electronics Forum | Wed Aug 12 12:32:56 EDT 1998 | Rich Croteau
Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple p
Electronics Forum | Mon Sep 14 07:19:34 EDT 1998 | Wayne Bracy
DB Sure, it is always possible to "duck in outside air" to use with production equipment, but be careful, you have to determine the air quality required for your process. Cosnsider moisture, contaminates and the actual forcing of air into a confine
Electronics Forum | Sat May 01 04:49:21 EDT 1999 | Jeff Sanchez
| Mornin! | | We just had vendor in here pitching a "low-temperature rework system" which was intriguing, but too expensive. He did get me to thinking though, beyond heating ceramic caps before hand-soldering them, it seems like it would be ad
Electronics Forum | Wed Sep 07 10:34:52 EDT 2005 | PWH
Have experienced this on a few different cap. parts. Agree with other postings. Following are solutions to problems we have had: 1) Cracked cap too close to board edge per IPC spec. Designer replaced part with 3 caps in series to eleviate stress
Electronics Forum | Thu Jan 31 07:49:38 EST 2008 | cyber_wolf
"What do I Really Need" is a subjective question.It all depends on who you ask. I have been in small mom and pop shops that were running BGA's and they were doing some scary stuff.(I wont go into details) In order to put a correct process together y