Electronics Forum | Thu Aug 27 11:17:02 EDT 1998 | Dave F
| hi, | I would like to ask for help if anybody is able to provide any information on the soldering method below. | (1)Hot-Bar Reflow Soldering | (2)Fiber Focussed IF Soldering. | I would really appreciate if you can share with me. | Thanks. | | be
Electronics Forum | Fri Apr 10 03:52:13 EDT 1998 | Frank J. de Klein
I would like to invite everyone to share/discuss information/knowledge/experience they have with the req's that are assumed to be valid for the temperature/time relation in the process of reflow soldering Pin In Paste, Intrusive Reflow or whatever yo
Electronics Forum | Mon Jul 26 15:05:36 EDT 2004 | Chris C
We are seeing un-Reflowed paste along the IC leads. There is only a very small amount imbedded in the flux, typically there is about 10 beads per lead. But on most leads. We are using no-clean Kester 256 paste (Easy Profile)We have not encountered th
Electronics Forum | Fri Feb 18 11:14:07 EST 2005 | russ
I would be willing to bet that you are ramping up way too fast and possibly too hot/long of a soak and killing your flux activity. this will give the appearance of "no reflow" due to non-coalescence of the solder balls. check this board with the hel
Electronics Forum | Mon Oct 31 09:52:23 EST 2005 | slthomas
The only problems I've ever had with 208's shifting out of alignment was with a board with too much HASL thickness. The lands had a convex profile and the parts kept slipping downslope. We put down a glue dot and ranted at our board supplier. Both
Electronics Forum | Fri Sep 26 07:26:33 EDT 2008 | realchunks
Looks like lack of wetting. What is the BGA ball material? Could be high temp. Could be improper profile. Could be paste sat on board too long / flux dryout. Could be co-plane mount and this ball touched at the end of reflow curve. Could be cont
Electronics Forum | Thu Jun 04 14:35:11 EDT 2009 | floydf
We wound up using a ramp to spike profile with 50 sec. between 150C and 217C and 90 sec. above 217C. The idea being the flux is still active when it hits reflow, and it stays in reflow long enough for the weird alloy in the parts lead to wet. All par
Electronics Forum | Wed Nov 11 11:36:18 EST 2009 | reash
Hello, We are looking for a lab and low volume reflow oven. I believe we want an IR/forced air combination oven? Nitrogen gas inlet would be good. Would like many adjustable temp profile segments. We saw the Manncorp T200N on their website. Is
Electronics Forum | Fri Sep 24 14:15:58 EDT 2010 | emrtech
we have been doing reflow on SLX PCBs and found out that when lidding, the components have been shifting. Has anyone been doing low temp lidding on SLX PCBs using the flowstar 4036 soldering system? If so, what low temp solder was used and profile
Electronics Forum | Fri Jan 07 07:45:44 EST 2011 | davef
Consider measuring the temperature of the BGA solder balls during reflow. This will give you a more accurate impression of the actual soldering temperature than you are getting now. The 1/6/2011 SMT Express Newsletter contained an interesting arti
.png)
