Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss
Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone
Electronics Forum | Thu Apr 01 12:05:21 EST 2004 | babe
Heat guns scare me, hot air scares me too. Just the heck of it why not apply high temp paste to the center and eutectic 63/37 standard solder to the outside pads. The outside reflows first allowing proper seating of the component and with a proper pr
Electronics Forum | Tue Jun 08 05:02:09 EDT 1999 | Charlie Thornton
Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven. I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely reflo
Electronics Forum | Wed Dec 04 04:28:58 EST 2019 | oxygensmd
It seems there isn't right connection between solder and solder-legs. Maybe check that the LEDs get huminidity, have some oxidation on the legs, try different solder paste, check the reflow solder profile. On the photo I can not saw properly reflowe
Electronics Forum | Thu Jun 03 10:09:59 EDT 1999 | Earl Moon
| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann
Electronics Forum | Thu Jun 03 10:53:09 EDT 1999 | Ryan Jennens
| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca
Electronics Forum | Thu Jun 03 12:31:30 EDT 1999 | Dave F
| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We
Electronics Forum | Thu Jun 03 13:00:16 EDT 1999 | Earl Moon
| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We
Electronics Forum | Thu Jun 03 14:06:16 EDT 1999 | Dave F
| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca
Electronics Forum | Thu Jun 03 15:19:14 EDT 1999 | Earl Moon
| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We
