Electronics Forum | Wed Sep 30 11:42:45 EDT 1998 | Ray N. Lopez Mata
I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. I would need the material to be of such a nature that I could form a cover by
Electronics Forum | Wed Sep 30 12:32:15 EDT 1998 | CHAD HAIMA
I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. | | I would need the material to be of such a nature that I could form a cov
Electronics Forum | Tue May 24 10:07:50 EDT 2011 | ck_the_flip
Does anyone have experience singulating CEM-1 substrates?
Electronics Forum | Thu Jun 02 15:21:18 EDT 2011 | davef
As long as it has been properly stored, we don't believe that old CEM will singulate any different than new CEM ... either should press well.
Electronics Forum | Thu Feb 03 06:21:57 EST 2000 | Ignacio Simon
I would like to have information about the materials commonly used for laminates of printed circuit boards, their main thermal, mechanical, humidity and electrical characteristics and proper finishing and aplicattions, and advantages/disadvantages be
Electronics Forum | Tue Dec 29 17:29:46 EST 1998 | Dave F
| can some kind of through hole type connector pass through | the smt process (with IR technology)???? | the temperature factor or material factor????? | Flag: Most PTH components are not spec'd for reflow processes. PTH component suppliers, nomin
Electronics Forum | Wed Feb 26 21:44:52 EST 2003 | Paul Dansereau
I will be building a board, about 8 X 12 , .062" thick using a standard FR406 stackup. It has a variety of devices, including CCBGA , CBGA and PBGA's. Given the challenge of developing a reflow profile that will accomodate both ceramic and plastic BG
Electronics Forum | Fri May 25 08:06:19 EDT 2007 | davef
Soldering PTFE boards * Exposure to the high temperatures needed for solder reflow poses no problem of loss of peel strength since the exposure times are relatively short. * There are many different types of PTFE based products that may perform diff
Electronics Forum | Tue Dec 29 03:37:09 EST 1998 | John W
| can some kind of through hole type connector pass through | the smt process (with IR technology)???? | the temperature factor or material factor????? | There's a company called Samtec (web site is www.samtec.com) who can provide these.They have a
Electronics Forum | Sat Mar 01 08:17:40 EST 2003 | davef
You're correct that the FR4 is probably the best choise. The majority of the problems in developing your reflow recipe is going to come from the CTE mismatches in the CCBGA , CBGA and PBGA that you put on the board. The other side says given the pr
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