Electronics Forum | Tue Mar 13 12:54:58 EDT 2007 | hynergy
You required the process control equipments. 1) Paste Height Checker: To measure the solder paste thickness after printing. 2) Temperature Profiler: To measure the reflow oven temperature whether is within the control spec.
Electronics Forum | Wed Oct 25 12:38:05 EDT 2000 | Phil
Hi there!! You know what your QA is doing is right, coz by measuring the solder paste height can avoid the following defects: 1.Insufficient solder 2.Short solder or bridging 3.Solder balls SPC monitoring for paste height checking is required
Electronics Forum | Fri Mar 30 07:24:43 EST 2001 | pteerink
Have you had bad experiences? We have a paste checker on line, and all components are verified at receiving and again when loaded on the machines. The purpose of AOI ( for us anyway ) is to reduce the time spent after reflow visually checking the b
Electronics Forum | Wed Jul 11 14:45:22 EDT 2007 | samir
ECD, KIC, or any mfgr. of thermal profiling devices will charge a premium for "simple stuff". For example, ECD charges a grand for their "flux-o-meter", which is just a PCB with a hole pattern, a pallet, and pH-sensitive paper. You can easily ma
Electronics Forum | Fri Nov 01 09:35:52 EST 2002 | James Bartlett
MINIMUM NDSU EMEG EQUIPMENT SPECIFICATIONS (11/1/02) To serve microsensor research and development via the Center for Nano-scale Science and Engineering (CNSE), the North Dakota State University (NDSU) Electronics Manufacturing Engineering Group (EM
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