Electronics Forum | Fri Jul 28 11:12:18 EDT 2023 | shrikant_borkar
Hi SimionR, Is Glue Process Dispencing or Glue Printing thru Stencil? if Its Dispencing Glue thru a Nozzle then its a controllable process. I have performed it thru HDP-3 Panasonic. Placement of Glue either one DOT or Process must be aligned with th
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Thu May 20 15:07:12 EDT 1999 | JohnW
Earl, your colourful impressive descrptions are a joy to read..well lighten's up my day but maybe it's just me...ummmm..? anyhoo, Omat, as Earl has said ..this is a moisture sensative problem basically the reason you blow the shit out of the compon
Electronics Forum | Sat May 22 19:38:59 EDT 1999 | Omat Marasigan
| Earl, | | your colourful impressive descrptions are a joy to read..well lighten's up my day but maybe it's just me...ummmm..? | | anyhoo, Omat, as Earl has said ..this is a moisture sensative problem basically the reason you blow the shit out of
Electronics Forum | Fri Aug 21 04:37:26 EDT 2009 | grahamcooper22
Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance.
Electronics Forum | Tue Aug 18 17:49:16 EDT 2009 | dyoungquist
Is there a limit to how many times a pcb with components can be run through a reflow oven before the components start to degrade? Example: We load the SMT components on the bottom side of the pcb and run it through the reflow oven. Next we load the
Electronics Forum | Thu Nov 30 21:38:22 EST 2006 | davef
We'll take a pix
Electronics Forum | Thu Sep 03 11:18:04 EDT 2009 | dyoungquist
We do not have any electrolytic capacitors on this board.
Electronics Forum | Mon Jul 02 09:28:24 EDT 2001 | blnorman
You can test for solder paste tack using IPC-TM-650 method 2.4.44. This will give you an idea of the adhesive strength of your paste prior to reflow.
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