Electronics Forum | Thu Nov 11 19:23:33 EST 1999 | Dave F
Gary: Sounds like the spacing between each pad for the component are too far apart. My 2�. Dave F
Electronics Forum | Tue Mar 01 14:47:48 EST 2005 | cabjerk
Hi: We started many years ago with totes on shelves 30 reels per side. Then we moved to 12" shelving with reel boxes. 5 reels per box. It was cheap and each was a single location. Great for finding and decrease cycle time in finding parts. Our wh
Electronics Forum | Wed Jun 12 04:02:00 EDT 2019 | liyunqiong
SMT reflow soldering temperature setting and process flow: The influence of SMT reflow process parameters on the key parameters of reflow soldering temperature curve provides reference for the setting and adjustment of reflow soldering process para
Electronics Forum | Thu Jun 13 05:46:34 EDT 2002 | jax
After reflow, Are the end terminals of the melf packages touching or is it a paste bridge? What type of reflow are you using? IR?... Convection?
Electronics Forum | Thu Oct 17 21:32:28 EDT 2002 | davef
Please help to clairify the problem. Are we talking: * A pre-reflow [placement] problem? * A post-reflow [solder wetting] problem? Is the wetting issue that you mention related to the board or to the component? Please give us a little more detail
Electronics Forum | Thu Jun 13 02:40:16 EDT 2002 | jax
Is the short apparent prior to reflow?
Electronics Forum | Tue Feb 15 16:55:15 EST 2005 | Indy
misaligned during which process ? -printing -placement -reflow Indy
Electronics Forum | Mon Feb 21 14:09:24 EST 2005 | JB
Is it before or after reflow?
Electronics Forum | Wed Aug 25 22:15:44 EDT 2004 | mmk
During BGA rework we are asked to protect adjacent compoennt from secondary and/or partial reflow. That is our normal process. However, the customer is asking that the peak temp of the joint at the adjacent component should not exceed 160C. Can you p
Electronics Forum | Wed May 17 03:56:20 EDT 2000 | Wolfgang Busko
Avichai: What kind of PCB are you using, when do you detect that shift (right after placement, before reflow, after reflow), does the shift always appear to be the same or do you see a variation, are you able to identify the process-step where it hap
