Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew
Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component
Electronics Forum | Wed Jan 10 09:57:08 EST 2007 | realchunks
Shields can carry a large thermal mass. If you ever tried removing one in repair, you'd find out how hard they can be. Also, they do deflect air flow. So in a convection oven, your air flow will be turbulent, which also will affect your reflow.
Electronics Forum | Mon Mar 04 17:47:44 EST 2019 | slthomas
The lowest peak temp. I've had the pleasure of working with is 240°C +/- 5°C. I can't imagine a manufacturer going much below that and still saying it's lead-free compatible. It would be interesting to know just how much TAL plays into the affect
Electronics Forum | Tue Feb 01 04:11:58 EST 2000 | emmanuel
I am to assembly a power SO on the top side of a double side board. My designer has implemented a lot of thermal vias in the heat sink pad of this component. The problem is that i need to prevent the solder cream from polluting the bottom side of the
Electronics Forum | Mon Feb 21 13:35:04 EST 2005 | pmdeuel
we have a HSP 4796, and have had placement issues with 0402's. If you can rule out global correction, rev'ed boards and a loose nest or a lack of support under the board. Look at placement before reflow. If alignment problems are present before oven
Electronics Forum | Fri Jan 12 19:49:07 EST 2007 | stepheniii
I think she might be more on track about the air flow. I would think they not only have thermal mass but also emit thermal energy well which would add to the dificutly of removing them. I think a Dpak would have more local thermal mass than the shie
Electronics Forum | Fri Sep 24 11:08:13 EDT 2004 | davef
We're not sure what you mean by temperature sensitive components. From an assembly process stand-point, every component we use is temperature sensitive to one level or another. More specifically, some of our products use polyphenylene sulfide (PPS)
Electronics Forum | Wed Feb 16 12:34:49 EST 2005 | greg
Hi all We recently have a problem with component in package 0805 (capasitor 100nF). I have noticed that after reflow soldering only one lead of the component is soldered. The second one is just laying on the PCB land. We use screen printing process
Electronics Forum | Mon Aug 06 14:08:56 EDT 2012 | dyoungquist
We run a MY12 and our largest layout has 9700 components of which about 8500 (88%) are placed by the Hydra head. Average run time for our layout is 75 minutes. Based on that and depending on what percentage of your components are Hydra mountable, y
Electronics Forum | Thu Apr 22 14:45:19 EDT 2021 | nhusa
The SMTA Space Coast /Atlanta presentation will have a bit more information.
