Electronics Forum | Thu Apr 24 23:04:45 EDT 2003 | yukim
I've been struggling with this problem for a while. We have two products: A, which is Ok and B, with tombstone defect (0603 & 0805 capacitor chips). A & B have the same design: pad sizes, separation between pads, components orientation. Both have s
Electronics Forum | Fri Apr 25 08:48:25 EDT 2003 | davef
If what you say is accurate, two thing come to mind: * Pads on the board are incorrect for the tombstoning components. * Profile is different on the individual pads of tombstoning components. We have heard of, but never seen, components [tants] that
Electronics Forum | Thu May 01 17:49:33 EDT 2003 | jym2000
Did you check board orientation into the reflow oven? (The Layout components are the same products A & B?) Regards Jesus
Electronics Forum | Mon May 05 03:53:41 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Mon May 05 03:53:47 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Wed May 07 09:02:17 EDT 2003 | Kris
Hi SnAg is a binary alloy and does not have the same effect as a ternary SnAgCu alloy as far the pasty range is concerned. But then paste only can do so much. The best way to do it is to have proper pad design, controlled placement and reflow. I w
Electronics Forum | Tue Jun 03 21:50:57 EDT 2003 | yukim
A question regarding the rampup slop: as we cannot make the preheat time long enough due to our reflow oven limits, a Loctite technician suggested we increase the rampup slope, between the initial point (25C) and 80C, to 4C/sec, as between these temp
Electronics Forum | Fri Sep 20 17:43:03 EDT 2019 | deanm
Looks like poor wetting/solderability to me. I don’t see heel fillets on the leads where the solder balls up. The solder has to go somewhere. It won’t flow where it won’t wet. Try printing a bare board and run through reflow. If the solder balls up o
Electronics Forum | Sat Mar 16 11:06:48 EST 2002 | Lau
Hi, I am searching a method of reflow process for less / nothing solder ball defect. Thank Lau
Electronics Forum | Wed Jun 10 04:00:46 EDT 2020 | ameenullakhan
Hi Phil, we used RSS profile initially , because of tombstone issue at 0201 package. We are planning to reduce soak a now to have flux till the end of reflow to avoid HIP now. and to support that . we are increasing over aperture opening also. Re
