Electronics Forum | Wed Apr 18 06:18:53 EDT 2007 | pavel_murtishev
Good afternoon, Huh. My sympathy. We have the same issue. Check this: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=11637&mc=3 BR, Pavel
Electronics Forum | Wed Apr 18 04:22:43 EDT 2007 | ray
I facing dewetting problem on Ag/Pd termination(chip component)during reflow process. The solder wetting is pull to terminal side and exhibits dewetting. Any one ever face the same problem and any solutions for the problem?
Electronics Forum | Thu Apr 05 07:02:22 EDT 2007 | pavel_murtishev
Good afternoon, Thanks for input AR. Fortunately, supplier can offer us nickel barrier alternative. I will do exactly as you did. BR, Pavel
Electronics Forum | Wed Apr 04 04:26:08 EDT 2007 | AR
Pavel, We had exactly the same kind of problem with exactly the same type of component. Our components were well within their best before -date so it is not question of that. As we could not get it to work we changed to nickel barrier finish on the
Electronics Forum | Wed Apr 04 03:07:16 EDT 2007 | pavel_murtishev
Good morning, Problem definition Poor soldering of thermistors with Ag/Pd termination Background Process: lead free reflow soldering Paste type: Multicore LF300, SAC305 Component type: 0805 chip thermistor, Ag/Pd termination PWB finish: immersion A
Electronics Forum | Thu Apr 19 16:54:32 EDT 2007 | flipit
I don't suggest using Pd/Ag or Ag/Pd terminated components unless you are forced to use them. You often see a line of demarcation that suggests a poorly wetted solder joint. I have had bad experiences with Pd/Ag terminated capacitors. Even when so
Electronics Forum | Wed Aug 29 11:07:39 EDT 2007 | mikecollier
I am being asked to perform the same evaluation now with a Au/Pd termination varistor. We currently use a Pb/Sn process with an RMA flux. The manufacturer of the device recommends going to a 2% silver paste. What is the intended advantage with 2%
Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef
Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c
Electronics Forum | Mon May 06 16:14:41 EDT 2002 | russ
Would the lead finish on this part happen to be Paladium? I had a problem similar to this some time ago and we found the lead finish was not tin/lead over copper but paladium over nickel. We had to increase the reflow to 225 deg. C peak temp with t
Electronics Forum | Mon May 06 11:49:20 EDT 2002 | Jacob
Hello all, I am having soldering issues with an Everlight component it is a TM4201/TR2 (Right angle IRDA with a 1mm pitch). The problem I have is that after reflow the solder joints look perfect, but during test we are losing 7 micro amps as soon as
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