Electronics Forum: reflow of innolot solder alloy (Page 1 of 1)

High Melting Point Solder with alloy composition of 93.5 Pb 5 Sn 1.5 Ag

Electronics Forum | Mon Aug 25 02:57:43 EDT 2014 | arjunkolavara

We are in the process of qualifying our SMT lines for the High Melting Point Solder with alloy composition of 93.5 Pb 5 Sn 1.5 Ag.If any one has already an experience with this alloy,kindly do give ur inputs on the process of profiling . The reflow d

High Melting Point Solder with alloy composition of 93.5 Pb 5 Sn 1.5 Ag

Electronics Forum | Mon Aug 25 08:15:54 EDT 2014 | jax

With a melting point of roughly 300°C, you would need to have the product see temperatures peaking around 325°C at a minimum. (I would make sure the components and PCB materials can withstand these temperatures) Most convection ovens do not go over 3

Solderability of a metal

Electronics Forum | Mon Mar 03 23:24:06 EST 2008 | Mag10

I have a project to evaluate solderability of various metals or plated finish. I'd like to tap in to get some advise. The project is to evaluate solderability of various metals or plated finishes for RF shield application with reflow. Due to the hig

Assemby of flexible printed circuits

Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef

Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies

Best source for 50lb of SN100C bar

Electronics Forum | Thu Jul 31 13:42:08 EDT 2008 | comatose

I'm looking to fill a solder fountain with 50lb of SN100C. My usual source for paste and the like doesn't stock this alloy. We run double sided reflow, so we're not going to be needing hundreds of pounds for a wave machine at any point. Who is the

Propensity of Immersion Tin surface finish fo whiskers

Electronics Forum | Thu Dec 08 13:17:31 EST 2005 | Amol Kane

during my researches for LF transition, a question being asked is -- why even consider immersion tin if it whiskers. does it really matter?, because during reflow, the Sn dissolves in the SAC solder alloy and does not exist in a "Sn whisker" formabl

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