Electronics Forum | Tue Dec 03 10:21:11 EST 2002 | jimlew
I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. Here's the answers to your questions: Placement Force: 0201s are placed on the Siemens S23s with 1 newton of force. The s
Electronics Forum | Tue Dec 03 20:54:57 EST 2002 | davef
Q1:A picture of the sectioned MLCC would be nice. A1: I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. R1: You�re correct. You cannot post pix on SMTnet. Please email me t
Electronics Forum | Wed Sep 21 18:09:03 EDT 2005 | PWH
We've had parts jump off pads on occasion due to panels or boards that are restricted in a carrier during reflow. The boards/panels expand and the restriction causes them to warp thus popping parts around during cool down. Doesn't sound like your p
Electronics Forum | Thu Mar 03 08:42:07 EST 2005 | cyber_wolf
I just ran into a reflow profiling problem with a new assembly that we are processing in SMT. There is a cluster of six or so electrolytic caps that measure approx. .710" wide by .660" tall. They are spaced .100" or so apart. When I run a profile, t
Electronics Forum | Fri Mar 21 09:08:53 EST 2003 | mantis
Hi all, I have a strange problem,while building a large 15x15inch 3.5mm thick Pcb.During topside reflow i am experiencing some misaligned parts and even bridging on a bga that are sitting very close to a D size tantalum cap.The strange thing is that
Electronics Forum | Thu Mar 03 09:11:25 EST 2005 | russ
I wouldn't raise the temps just slow the conveyor, You need to get the PCB "soaked in". It seems as if you are applying more thermal energy than the PCB can accept in all areas. Does this oven have convection heating? Hopefully so. I have found t
Electronics Forum | Thu Aug 23 16:01:59 EDT 2001 | Steve
You made the statement "The rest of the board we use them on looks great..." My question is, what's the difference between the assemblies? Mass? Solder? Oven? Are the boards the same thickness, are other parts causing heat sinking, etc. The reflow m
Electronics Forum | Mon Feb 22 10:01:01 EST 2010 | jtsyeung
Since the inductor is electro-magnetic, that means the device is composite of coil and ferrite metal. The inductor inside the reflow oven meets with blower motors which close to the inductor and generate magnetic field. With such conditions, Lawren
Electronics Forum | Thu Jan 26 12:46:53 EST 2017 | dyoungquist
We run double sided boards that have large SMT electrolytic caps on the top side using the same profile for both sides. The trick is to do the bottom side first, then the top side. That way you do not need to glue down the large caps.
Electronics Forum | Wed Sep 17 04:15:23 EDT 2003 | C Miller
The magnetic thing from the sot23 thread made me think of somthing from the past. Does anyone have any experience with vibrating boards during reflow? I know for a fact that if you vibrate a board during reflow it will alow the parts to "float" and
