Electronics Forum | Wed Mar 14 18:17:40 EST 2001 | mparker
Some thing to watch out for is the cure spec for the adhesive. Will that match with your solder paste reflow spec? You will have two dissimiliar materials going through endothermic reactions at the same time. You could end up with under cured adhesiv
Electronics Forum | Mon Oct 20 11:48:34 EDT 2003 | blnorman
Who said there was NO evaluation? The paste we chose was evaluated based on a 20 point test score as well as material compatibility. Once we introduced it to manufacturing each line had problems. For one manufacturing treated it as a drop in repla
Electronics Forum | Sat Jul 01 00:20:08 EDT 2017 | aemery
Kelly, it's been a long while since I repaired a BRAVO. The machine was a little unique as far as Electrovert ovens go. I am pretty sure that it is the only Speedline model that integrated a PLC. Loved the OMNI's, not so much with the Bravos. I a
Electronics Forum | Fri Nov 12 13:07:45 EST 2010 | G8reflow
Hi, The focal point of my research has been to recommend a reflow oven and develop a process for a small to low-medium production SMT soldering with the following considerations. - Lead-Free - Low to low-medium production - Forced Convection reflow
Electronics Forum | Fri Feb 13 08:54:43 EST 1998 | justin medernach
| Hi , | I have not been able to find any good description on how to perform double sided reflow on PCBs.The best would of course be to avoid reflowing the bottom side again but in real life this is not possible. | So when double sided reflow sol
Electronics Forum | Tue Oct 12 16:38:24 EDT 1999 | Charlie
At present the band-aid fix is using epoxy 'dam' under the part and masking over the part to pervent excessive current leakage conmonent failure. These parts are first going through the reflow oven, where the epoxy dam is used to over come the leakag
Electronics Forum | Mon Aug 16 20:22:54 EDT 2004 | Grant
Hi, Thanks for the info! In the software can you add solder paste specs and heat sensitive components and see where the profile sits against these fast? Measurement is the easiest part I think, but what I thinks harder is good software to analyze th
Electronics Forum | Tue Feb 11 13:22:22 EST 2020 | rgduval
Sebas, I suspect that your finding of needing the fillet for the card to work is a false finding. One that I dealt with for many years in assembly. As a bottom terminated device, a fillet to the side terminals of the device is not required. Adequ
Electronics Forum | Tue May 20 06:00:33 EDT 2008 | roc2x
Im qualifying a new PCB. I run 2 diff supplier. Supplier A has Zero failure. Supplier B has 4 failure all having Lifted PAD on Bga same location and same location pads that lifted. How can I prove that the PCB have problem? Input : Both run in same o
Electronics Forum | Wed Apr 21 18:24:13 EDT 2004 | pjohnson@volterra.com
Simple process - we use similar Kester solder brands of "no clean" low residue solder wick to clean our pads, then brush with isopropyl, and apply Kesters brand of tacky flux under a Leica 6x microscope. We do this on 7x7mm and 9x9mm packages. This w
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