Electronics Forum: reflow oven process validation (Page 4 of 94)

how to control warpage on panelized pcb during reflow process

Electronics Forum | Mon May 13 06:38:41 EDT 2019 | relaycz

You need to give us a little more information. 1. What is the size of your panel? 2. Are there any heavy components? 3. What is the thickness of your board panel? 4. What kind of oven are you using? 5. Is it only a recent problem or ongoing one?

SMT process Blowhole/ Pinhole

Electronics Forum | Fri Mar 28 00:56:50 EST 2003 | iman

we have a issue of post-reflow oven (SMT) soldering defects of blowholes and pinholes. Any suggestions or knowledge on root cause is appreciated to be share? BACKGROUND : we DI water wash and oven bake the PCB bareboards at 90deg-C for 60mins, to r

Bottom side process question

Electronics Forum | Fri Mar 16 15:52:22 EST 2001 | blnorman

We screen print epoxy adhesive, place components then run the board through our adhesive oven (2-5 min cure at 150�C). This is in addition to reflow.

SMT process consultants

Electronics Forum | Mon Oct 08 22:25:19 EDT 2001 | caldon

See PeteC under the recent forum entry on "Reflow Ovens"....Pete is a true wealth of knowledge. I will try to post his info at a later date. Cal Manncorp

Reball BGA process flow

Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ

Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply

BGA process requirements

Electronics Forum | Fri Apr 19 09:41:45 EDT 2002 | angiewest

We have been building BGA's for a couple of years. We even use a Universal Omni 4766 to place them with. Reflowing is where I thought we may have problems, Since we have an IR oven. But we bought a .010" thermocouple from Omega to measure the BGA

Re: SMT process benchmarks??

Electronics Forum | Wed Jun 10 14:48:12 EDT 1998 | Chrys

| | Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. | | Example: | | Screen Print = 45% of total defects | | Component Placement = 25% of total defects |

seeking better process

Electronics Forum | Fri Mar 16 11:52:31 EST 2001 | J.D. of Panasonic

Ed, You certainly are ready for some equipment. I noticed in your message that you mentioned cost three times. So it is a very big issue to you. What everything depends on is where you see your company going in the next few years. Do you want

Questions on underfill process

Electronics Forum | Fri Jun 08 15:37:41 EDT 2007 | ck_the_flip

Jim: I have limited knowledge, but here's what I know: 1. Yes, it's a standard process. In today's SMTNet, it's rarely mentioned, and few people reply to postings. 2. Nope. It's a "specialty" piece of equipment for most CEM's. Depending on you

Re: SMT process benchmarks??

Electronics Forum | Wed Jun 10 18:50:36 EDT 1998 | Earl Moon

| | | Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. | | | Example: | | | Screen Print = 45% of total defects | | | Component Placement = 25% of total de


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