Electronics Forum | Sat Sep 08 19:04:26 EDT 2012 | jlawson
You might also want to consider process repeatability cross profile performance over time and energy consumption. Also reliabilty is effected by shift usage etc,. Eg could have oven that might appear reliable in one context but not overall. Ie total
Electronics Forum | Sat Sep 22 09:07:56 EDT 2001 | davef
Back-stepping a bit. If a profile is being used to: * Set-up the oven for a new product or trouble-shooting process, the profile should be taken with a solid contact to a solder connection. * Monitoring on-going stable and in-control process that re
Electronics Forum | Fri Nov 13 18:29:50 EST 2009 | luisreyes
really need help!! Our company is experiencing a change on the Quality system. one of the things that we are discovering is the amazing variation during the reflow oven and wave solder processes. this week we found that the team had not been performi
Electronics Forum | Fri Nov 12 13:07:45 EST 2010 | G8reflow
Hi, The focal point of my research has been to recommend a reflow oven and develop a process for a small to low-medium production SMT soldering with the following considerations. - Lead-Free - Low to low-medium production - Forced Convection reflow
Electronics Forum | Wed Aug 08 14:32:50 EDT 2012 | leemeyer
According to Quad data sheet, the max process temp on a ZCR oven is 310C. I am taking a guess that the "Critical Temperature" message may be Quad's way of saying that you have entered to high of a setting. Try bringing the setpoints to something belo
Electronics Forum | Thu Nov 16 22:01:06 EST 2017 | deanm
That model comes standard without bottom preheaters. Bottom preheaters are an option so I would think it is designed for general use unless you have some very thermally challenging boards. As long as you are within the process window, you'll be fine.
Electronics Forum | Wed Jan 25 00:29:22 EST 2017 | cmarasigan
This is our practice already, common profile both sides and we perform it during NPI stage. As long as zone settings are the same and profile requirements are meet, we consider it as same profile and no need to re-profile from bottom side process to
Electronics Forum | Mon Mar 26 08:52:19 EDT 2007 | realchunks
Hi J, Yes, we do too. Funny thing is I was just looking at this last Friday. We call it sharing the bottom of the barrel. Typically it's just Process Engineers stuck down here, but from time to time, Maintenance gets stuck down here too. When in
Electronics Forum | Fri Dec 03 16:00:48 EST 2010 | glenseely
When faced with high mass, high cost, sensitive PCBs and now with the added challenges of Pb-Free Vapor Phase is the only safe reflow method for component and joint integrity. A-Tek is the National Distributor for Asscon Vapor phase reflow. Asscon
Electronics Forum | Wed May 21 13:26:46 EDT 2003 | Brian W.
Something else to keep in mind when you reflow using an IR (non-convection) oven. IR reflow is more susceptible to variations in board mass and coloration than convection ovens. Hi mass areas and dark colored parts will cause more variation in your
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