Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie
We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro
Electronics Forum | Tue Aug 17 03:26:57 EDT 2004 | soease
Well, regarding the paste specifications, it's no problem to add yours if it's not allready defined in the default library; parameters are for example, soak temp min & max, liquidous, ramp positive max, spike ramp min & max, all timings and so on. n
Electronics Forum | Wed Apr 16 11:29:31 EDT 2008 | mmjm_1099
Per Tony SMT Here are more photos: Q15, Q16, Q17 represent good transistors on a 1 up board with the transistor locations that are in question. Q13 is a good transistor on a bad 2up board. Right next to it is Q14 a bad transistor on a bad 2 up boa
Electronics Forum | Thu May 18 08:12:22 EDT 2006 | marc
smt You should have no issue using your exsisting oven for both leaded and lead free materials if the machine is capable of delivering the desired profiles. One aspect that makes a "lead free" oven is the design of the system. Ability to reach th
Electronics Forum | Wed Jan 04 13:59:14 EST 2006 | chunks
Ask your customer why they need this? Show them your process. Then bury them in their own unknowledgeable requests. It is pretty scary how many papers are also written about how easy it is to reflow a lead-free BGA with regular leaded paste. ht
Electronics Forum | Fri Nov 22 13:41:55 EST 2002 | cristiano
We are experiencing problems with a smartmedia connector during the reflow solder process. The connectors stay a little bended after the oven. In this case the middle leads are not solded, because they stay with no contact on the board. The conector
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Mon Aug 19 16:57:38 EDT 2002 | dragonslayr
Individual process steps are approximately the same length of time for reworking a BGA. You seem to be comparing the use of the automated SMT line versus an off line rework station. Consider that the off line station is a complete paste print, pick
Electronics Forum | Thu Aug 30 11:59:00 EDT 2001 | Spanky
Hey all, I have 3 questions about reflow. Hopefully someone can help me. 1. I am having a problem. I set the peak at 230 and my mole thermocouples are telling me the temp in that zone gets to 237. How is this possible even if the thermocouple
Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
