Electronics Forum | Mon Mar 31 07:58:50 EDT 2008 | vinitverma
Assuming the following: L=Process Length of the oven t=Desired profile time in mins(depends on the paste/glue used) l=PCB length l1=gap between consecutive PCBs Then the total no. of PCBs per hour is" (L*60/t)/(l+l1) Vinit
Electronics Forum | Thu Mar 13 08:39:53 EDT 2008 | ck_the_flip
Takt time (without a google search) is the rate (amount of time per pc.) at which stuff gets made on an assembly line, a workcell, a hi-speed SMT line, CNC machine cell, etc.... Takt time is governed by the gate (the slowest person, machine, etc. in
Electronics Forum | Tue Oct 05 14:06:26 EDT 2021 | oclsc
Hi SMTnet. It is possible to reflow BGA's 0.65 pitch with a convection oven that only have heating zones on one side (topside) or is it a must to have heating zones on both sides in the oven (top and botton). Regards Ole C. Denmark
Electronics Forum | Wed Oct 06 20:23:38 EDT 2021 | stephendo
If you can, it would be best to have a scrap board with a scrap BGA and drill a small hole in the bottom of the PCB and attach the thermocouple lead to a ball. This is assuming that you have a convection oven. If you have an IR oven, and that is wh
Electronics Forum | Tue Jun 20 20:22:15 EDT 2000 | Dave F
Hi Jack: Welcome!!!! Yours sounds like an interesting project. In response to your questions: A1. Each traditional L8 run requires 8 runs. So, how did you select a L8? A2. In addition solder height and volume as characteristics, consider deposit
Electronics Forum | Fri Dec 08 21:23:16 EST 2006 | Harsha
I am seeing a problem of flux droping on the PCBA during reflow. This is a pb free process and I am using KOKI pb free paste with 8 zone (and some 9 zone) reflow ovens. Line throughput is about 10,000 boards/24 hours. I suspect that the exhaust is no
Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David
Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b
Electronics Forum | Sun Sep 11 01:25:34 EDT 2005 | Mika
I agree with prior postings, but there is no perfect yes/no answers, right (left)...? Only good questions to be answered. I think it is overkill to have an extra stencil, why do you need it? (That is if you have a proper stencil cleaning equipment).
Electronics Forum | Mon Jun 13 04:26:00 EDT 2005 | Joris Groot koerkamp
For the lead free reflow process we tested with our Vitronics 500smr oven. To reach the high temperature of the lead free profile was no problem. We are not using an active cooling system so the pcb's are maby to hot wen the leaving the oven. Can an
Electronics Forum | Thu Aug 19 08:22:05 EDT 2004 | Rafal M.
Hello. I have a problem with reflow soldering of PCBs with golden pads. Peste explodes in the oven. I don't know in witch phase of process (in what point of profile) it happens. It's the reason of problems with golden pads - it's dirty when going out
